Abstract: A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows:1. condition with an oxidant solution;2(A). contact with a copper etchant that etches copper and neutralizes oxidant residues on the surface to be plated; and2(B). contact with a conditioner that conditions the board surface for enhanced catalyst adsorption; or2(A). contact with a neutralizer for oxidant residues that neutralizes said residues and conditions the board surface for enhanced catalyst adsorption; and2(B). contact with a copper etchant; and3. catalyze the board; and4. plate electroless metal onto catalyzed surfaces from a plating solution containing a source of halide ions in a concentration of at least 0.1 moles per liter of solution.The process is characterized by the absence of a step of acceleration and contains fewer processing steps than prior art processes.

Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

Abstract: In a method for determining the machinability of a metal substrate for use in an electromechanical recording apparatus a surface of a foundation is coated with a layer of metal. The metal layer is machined such that the metalized surface of the foundation is substantially flat and smooth. After the machining step, the metal surface is inspected for depressions with a microscope using a differential interference contrast technique. The number of depressions observed is indicative of the machinability of the coated foundation.

Abstract: An etching solution for etching composite structures of silicon nitride on silicon oxide on silicon substrates which etches the silicon nitride at a rate equal to or faster than the silicon oxide which comprises concentrated aqueous hydrogen fluoride in a high boiling, organic solvent.

Abstract: A method of inspecting electrical devices such as integrated circuit devices which have conductors covered by a protective layer of passivating material to determine the quality of the protective layer includes treating the circuit with a fluorescein containing dye and exposing the treated device to UV radiation while applying a voltage between two conductors. Fluorescence is observable in well passivated areas of the device but not in unpassivated or inadequately passivated areas. When a device is tested before dicing from a wafer, adjacent devices to which no voltage is applied fluoresce in both passivated and unpassivated areas.

Abstract: A process for pretreating polyvinyl chloride plastics to form adherent non-grainy conformal metal coatings by electroless deposition comprising immersing the polyvinyl chloride plastic in a solution comprising at least about 10 grams of alkali metal hydroxide dissolved in a solution consisting of about 5% to about 30% by volume of a water-soluble mono-, di-, or polyhydric alcohol and about 70% to about 95% by volume of water. The immersion time is variable from about 5 minutes in ultrasonically agitated, mildly heated solutions to about 6 to about 8 hours in non-agitated, unheated solutions. After pretreatment, the polyvinyl chloride plastic is treated by standard electroless plating procedures known in the art.