Patents by Inventor Cheryl B. Field

Cheryl B. Field has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6867543
    Abstract: A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base portion (32) and the lid (34) is hermetically sealed to the base portion (32). The housing (30) defines a cavity (38) surrounding the device microstructure (22). The fine grain getter layer (40) is on an interior side (42) of the lid (34) for maintaining a vacuum in the cavity (38) surrounding the device microstructure (22). The lid (34) may be made of metal or have at least a metallic surface in the region where the fine grain getter layer (40) is applied. The fine grain getter layer (40) has a sub-micron grain size. There is also a method for making the microdevice assembly (20).
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: March 15, 2005
    Assignee: Motorola, Inc.
    Inventors: Joe P. Wang, Cheryl B. Field, Michael Pfeifer
  • Publication number: 20040189198
    Abstract: A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base portion (32) and the lid (34) is hermetically sealed to the base portion (32). The housing (30) defines a cavity (38) surrounding the device microstructure (22). The fine grain getter layer (40) is on an interior side (42) of the lid (34) for maintaining a vacuum in the cavity (38) surrounding the device microstructure (22). The lid (34) may be made of metal or have at least a metallic surface in the region where the fine grain getter layer (40) is applied. The fine grain getter layer (40) has a sub-micron grain size. There is also a method for making the microdevice assembly (20).
    Type: Application
    Filed: March 31, 2003
    Publication date: September 30, 2004
    Inventors: Joe P. Wang, Cheryl B. Field, Michael Pfeifer
  • Patent number: 4546066
    Abstract: A method for providing very narrow resolvable line widths on a semiconductor substrate surface involves initial overexposure of a positive working photoresist through a mask so as to not only expose the portions of the photoresist corresponding to the transparent areas of the mask but to also expose the outer periphery of the photoresist areas corresponding to the opaque areas of the mask. Through subsequent processing, the areas of the substrate surface corresponding to the originally unexposed areas of the photoresist are made available for use in semiconductor fabrication, such as areas to be oxidized to function as narrow electrical isolation areas.
    Type: Grant
    Filed: September 27, 1983
    Date of Patent: October 8, 1985
    Assignee: International Business Machines Corporation
    Inventors: Cheryl B. Field, Russell C. Lange