Abstract: Described herein are embodiments of thermal donor laminate formulations and thermal transfer donor elements comprising the same. Thermal donor elements described herein can be used to transfer the laminate onto thermal receiver elements using thermal transfer means to create a transparent, protective overcoat film. In certain embodiments, the laminate is formulated without colloidal silica. Laminate formulations comprise appropriate solvent packages to account for the removal of colloidal silica, including, in some embodiments, solvent packages that do not include DEK. Certain embodiments described herein exhibit advantageous performance characteristics, such as avoiding and/or mitigating flash, satin back transfer, and print artifacts, and resist scratches.

Abstract: Described herein are embodiments of thermal donor laminate formulations and thermal transfer donor elements comprising the same. Thermal donor elements described herein can be used to transfer the laminate onto thermal receiver elements using thermal transfer means to create a transparent, protective overcoat film. In certain embodiments, the laminate is formulated without colloidal silica. Laminate formulations comprise appropriate solvent packages to account for the removal of colloidal silica, including, in some embodiments, solvent packages that do not include DEK. Certain embodiments described herein exhibit advantageous performance characteristics, such as avoiding and/or mitigating flash, satin back transfer, and print artifacts, and resist scratches.

Abstract: Described herein are embodiments of thermal donor laminate formulations and thermal transfer donor elements comprising the same. Thermal donor elements described herein can be used to transfer the laminate onto thermal receiver elements using thermal transfer means to create a transparent, protective overcoat film. In certain embodiments, the laminate is formulated without colloidal silica. Laminate formulations comprise appropriate solvent packages to account for the removal of colloidal silica, including, in some embodiments, solvent packages that do not include DEK. Certain embodiments described herein exhibit advantageous performance characteristics, such as avoiding and/or mitigating flash, satin back transfer, and print artifacts, and resist scratches.