Patents by Inventor Cheryl Field

Cheryl Field has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of separating and handling a thin semiconductor die on a wafer
    Patent number: 6772509
    Abstract: A method of separating a thin die (20, 60) from a support body (72) of a semiconductor wafer (70). The thin die (20, 60) being initially attached to the support body (72) by an attachment mechanism (78, 178). The attachment mechanism may be a plurality of tethers (78, 178) that extend between the thin die (20, 60) and the support body (72).
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: August 10, 2004
    Assignee: Motorola, Inc.
    Inventors: Shiuh-Hui Steven Chen, Cheryl Field, Didier R. Lefebvre, Joe Pin Wang
  • Method of separating and handling a thin semiconductor die on a wafer
    Publication number: 20030140486
    Abstract: A method of separating a thin die (20, 60) from a support body (72) of a semiconductor wafer (70). The thin die (20, 60) being initially attached to the support body (72) by an attachment mechanism (78, 178). The attachment mechanism may be a plurality of tethers (78, 178) that extend between the thin die (20, 60) and the support body (72).
    Type: Application
    Filed: January 28, 2002
    Publication date: July 31, 2003
    Inventors: Shiuh-Hui Steven Chen, Cheryl Field, Didier R. Lefebvre, Joe Pin Wang