Abstract: A method for making a leadless chip carrier (LCC) for use in electronic packages having a core layer stripped of copper cladding, containing drilled clearance holes within, a layer of resin coated copper (RCC) placed on the upper surface of the core layer and a second layer of RCC placed on the lower surface of the core layer. The layers are laminated together with the RCC filling the clearance holes during lamination. A pattern is etched on the RCC and vias are drilled through the filled clearance holes and pre-plated with seed copper layers. The seed copper layers in the vias are then covered by a layer of copper plating to meet the requirements of the core buildup layer, and resin inhibiting conductive anodic filament (CAF) growth within the structure.

Abstract: An information handling system which includes as part thereof a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Abstract: A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Abstract: A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder “islands”. A solder flux is then deposited onto the “islands” causing these to spread out and form a continuous solder layer across the conductor's upper surface. The solder layer is then capable of coupling to an external conductor such as a solder ball, to form an electrical assembly such as might be used within an information handling system such as a personal computer.

Abstract: A circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate is also provided, as is a circuitized structure including the circuitized substrate in combination with other circuitized substrates having lesser dense thru-hole patterns. An information handling system incorporating the circuitized substrate of the invention as part thereof is also provided.

Abstract: A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Abstract: An information handling system which includes as part thereof a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Abstract: A circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate is also provided, as is a circuitized structure including the circuitized substrate in combination with other circuitized substrates having lesser dense thru-hole patterns. An information handling system incorporating the circuitized substrate of the invention as part thereof is also provided.