Abstract: An electronic system includes a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer includes parylene. Furthermore, the electronic system includes an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments being described and/or claimed.

Abstract: An electronic system may include a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer may include parylene. Furthermore, the electronic system may include an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments may be described and/or claimed.

Abstract: A process is disclosed for preparing a polysulfide-epoxy prepolymer and cured co-polymer using a heavy ends waste generated in chlorinated hydrocarbon production. The process comprises first distilling the heavy ends waste to form an enriched heavy ends waste with an ethylene dichloride content less than about 10% by weight. The enriched heavy ends waste is then reacted with an alkaline polysulfide within a temperature range of about 50.degree. C. to about 150.degree. C. to form a polysulfide polymer mixture. Next, between about 5 and about 300 parts of the polysulfide polymer mixture is co-reacted with a hundred parts by weight of an epoxy resin to form a polysulfide-epoxy prepolymer or a cured co-polymer if a curing agent is present.