Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Abstract: A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

Abstract: A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Abstract: In one aspect, an improved wafer mount tape is provided. The wafer mount tape includes a base layer, a release layer that expands when activated and a B-stageable adhesive layer that is positioned over the release layer. In a method aspect of the invention, a wafer level method of placing an adhesive layer on the back surface of integrated circuit devices is described. In this aspect, a wafer is secured to the mount tape. The wafer is diced while the wafer is attached to the mounting tape. After the wafer has been diced and any other desired wafer level processing is completed, the dice may be released individually or in groups by heating (or otherwise activating) localized areas of the tape under selected die to a temperature sufficient to release the selected die. The expansion of the release layer during the release operation serves to lift the selected die relative to adjacent die thereby facilitating picking.

Abstract: In one aspect, an improved wafer mount tape is provided. The wafer mount tape includes a base layer, a release layer that expands when activated and a B-stageable adhesive layer that is positioned over the release layer. In a method aspect of the invention, a wafer level method of placing an adhesive layer on the back surface of integrated circuit devices is described. In this aspect, a wafer is secured to the mount tape. The wafer is diced while the wafer is attached to the mounting tape. After the wafer has been diced and any other desired wafer level processing is completed, the dice may be released individually or in groups by heating (or otherwise activating) localized areas of the tape under selected die to a temperature sufficient to release the selected die. The expansion of the release layer during the release operation serves to lift the selected die relative to adjacent die thereby facilitating picking.