Patents by Inventor Chetan Sanjay Agarwal

Chetan Sanjay Agarwal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINKS FOR BARE DIE MULTI-CHIP PACKAGES
    Publication number: 20250138602
    Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
    Type: Application
    Filed: January 3, 2025
    Publication date: May 1, 2025
    Applicant: Amazon Technologies, Inc.
    Inventors: Ali Elashri, William Mark Megarity, Ryan F. Conroy, Chetan Sanjay Agarwal, Priti Choudhary
  • Heat sinks for bare die multi-chip packages
    Patent number: 12222776
    Abstract: Various mounting systems for mounting heat sink apparatus to bare die processors are disclosed. The mounting systems include an upper plate, which may include a heat transfer portion, positioned in proximity to the upper surface of bare die processors to provide heat conduction away from the processors. The disclosed mounting systems secure the upper plate to the processors with balanced and centralized forces to inhibit tilting of the upper plate and reduce the risk of damaging the processors.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: February 11, 2025
    Assignee: Amazon Technologies, Inc.
    Inventors: Ali Elashri, William Mark Megarity, Ryan F Conroy, Chetan Sanjay Agarwal, Priti Choudhary