Patents by Inventor Chetan Verma

Chetan Verma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10965328
    Abstract: Overhead communications with wireless wearable devices are disclosed. An example overhead wireless transmission interface apparatus includes a fixture to be mounted above a wearable device, where the wearable device includes a first antenna, and a base station associated with a second antenna, the second antenna coupled to the fixture and to wirelessly communicate with the first antenna, where at least one of the first antenna or the second antenna is circular polarized or diversity polarized.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: March 30, 2021
    Assignee: INTEL CORPORATION
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Publication number: 20200153462
    Abstract: Overhead communications with wireless wearable devices are disclosed. An example overhead wireless transmission interface apparatus includes a fixture to be mounted above a wearable device, where the wearable device includes a first antenna, and a base station associated with a second antenna, the second antenna coupled to the fixture and to wirelessly communicate with the first antenna, where at least one of the first antenna or the second antenna is circular polarized or diversity polarized.
    Type: Application
    Filed: January 15, 2020
    Publication date: May 14, 2020
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Publication number: 20200098300
    Abstract: Example methods, apparatus, systems, and articles of manufacture to set a blue light cutoff time of an electronic device are disclosed herein. An example electronic device disclosed herein includes a display screen to emit first light in a first mode and second light in a second mode. The first light includes light having a characteristic that negatively affects sleep and the second light has less of the light having the characteristic that negatively affects sleep than the first light. The example electronic device also includes a display color adjuster to set a blue light cutoff time based on sleep data received from a sleep tracking device, and the display is to switch from the first mode to the second mode at the blue light cutoff time.
    Type: Application
    Filed: April 19, 2017
    Publication date: March 26, 2020
    Inventors: Chetan Verma, Unnikrishnan Pillai
  • Patent number: 10574275
    Abstract: Overhead communications with wireless wearable devices are disclosed. An example overhead wireless transmission interface apparatus includes a fixture to be mounted above a wearable device, where the wearable device includes a first antenna, and a base station associated with a second antenna, the second antenna coupled to the fixture and to wirelessly communicate with the first antenna, where at least one of the first antenna or the second antenna is circular polarized or diversity polarized.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: February 25, 2020
    Assignee: INTEL CORPORATION
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Patent number: 10540974
    Abstract: Embodiments include apparatuses, systems, and methods for assisting in detection of user commands by virtual assistant devices. In embodiments, an apparatus for assisting or facilitating assistance to a user may include a first communication interface to receive an audio signal and a second communication interface to receive a modulated audio signal. In embodiments, a speech-recognition processor may be coupled to the first communication interface to detect a presence of a command in the audio signal. In embodiments, the command may include or be preceded by a keyword. In embodiments, a controller may be coupled to the second communication interface and the speech-recognition processor, to extract data from the modulated audio signal, and to dispose the detected command based at least in part on the data extracted on the modulated audio signal. Other embodiments may also be described and claimed.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: January 21, 2020
    Assignee: Intel Corporation
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Publication number: 20190386689
    Abstract: Overhead communications with wireless wearable devices are disclosed. An example overhead wireless transmission interface apparatus includes a fixture to be mounted above a wearable device, where the wearable device includes a first antenna, and a base station associated with a second antenna, the second antenna coupled to the fixture and to wirelessly communicate with the first antenna, where at least one of the first antenna or the second antenna is circular polarized or diversity polarized.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Patent number: 10452993
    Abstract: A method for applying personalized machine learning models is provided. The method includes producing one or more feature vectors that represents features of one of a plurality of files of a file system and selecting, from a plurality of personalized machine learning models that model user accesses to the files of the file system a subset of the personalized machine learning models each of which has a plurality of non-zero weights corresponding to non-zero features of the one or more feature vectors. The method includes determining from the subset of personalized machine learning models which users of a plurality of users of the file system are likely to access the one of the plurality of files.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: October 22, 2019
    Assignee: SYMANTEC CORPORATION
    Inventors: Michael Hart, Chetan Verma
  • Patent number: 10439657
    Abstract: Overhead communications with wireless wearable devices are disclosed. An example overhead wireless transmission interface apparatus includes a fixture to be mounted above a wearable device, where the wearable device includes a first antenna, and a base station associated with a second antenna, the second antenna coupled to the fixture and to wirelessly communicate with the first antenna, where at least one of the first antenna or the second antenna is circular polarized or diversity polarized.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: October 8, 2019
    Assignee: INTEL CORPORATION
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Patent number: 10360732
    Abstract: Techniques related to a system, article, and method of determining object positions for image processing using wireless network angle of transmission.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: July 23, 2019
    Assignee: Intel Corporation
    Inventors: Prasanna Krishnaswamy, Himanshu Bhalla, Chetan Verma
  • Publication number: 20190052111
    Abstract: System and techniques for wireless charging of a portable virtual reality (VR) host system are described herein. The present subject matter provides various examples to power a portable VR host system that allows for free movement by the user. In various embodiments the present subject matter provides connections on the footwear of the user that supply electrical power to a VR host worn by the user. In various examples, a connection technology is employed to provide connections between the user wearing the VR host system and conductive mats, plates, or flooring that are powered to provide electrical power to the VR host system via connections to the user's apparel when standing. Other forms of connection technology may be employed, such as inductive wireless technology or radio frequency signal technology that uses wireless power coils or antennae to receive power and provide it to the VR host worn by the user.
    Type: Application
    Filed: November 16, 2016
    Publication date: February 14, 2019
    Applicant: Intel Corporation
    Inventors: Jr-Wei Wu, Chetan Verma, Aiswarya M. Pious
  • Publication number: 20190044549
    Abstract: Overhead communications with wireless wearable devices are disclosed. An example overhead wireless transmission interface apparatus includes a fixture to be mounted above a wearable device, where the wearable device includes a first antenna, and a base station associated with a second antenna, the second antenna coupled to the fixture and to wirelessly communicate with the first antenna, where at least one of the first antenna or the second antenna is circular polarized or diversity polarized.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 7, 2019
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Publication number: 20190043498
    Abstract: Embodiments include apparatuses, systems, and methods for assisting in detection of user commands by virtual assistant devices. In embodiments, an apparatus for assisting or facilitating assistance to a user may include a first communication interface to receive an audio signal and a second communication interface to receive a modulated audio signal. In embodiments, a speech-recognition processor may be coupled to the first communication interface to detect a presence of a command in the audio signal. In embodiments, the command may include or be preceded by a keyword. In embodiments, a controller may be coupled to the second communication interface and the speech-recognition processor, to extract data from the modulated audio signal, and to dispose the detected command based at least in part on the data extracted on the modulated audio signal. Other embodiments may also be described and claimed.
    Type: Application
    Filed: May 30, 2018
    Publication date: February 7, 2019
    Inventors: Unnikrishnan G. Pillai, Chetan Verma
  • Publication number: 20180276841
    Abstract: Techniques related to a system, article, and method of determining object positions for image processing using wireless network angle of transmission.
    Type: Application
    Filed: March 23, 2017
    Publication date: September 27, 2018
    Applicant: Intel Corporation
    Inventors: Prasanna KRISHNASWAMY, Himanshu BHALLA, Chetan VERMA
  • Patent number: 9754109
    Abstract: A computer-implemented method for managing access may include (1) identifying an attempt to perform, within a computing environment, an action that involves a specific entity, (2) determining that the attempted action is anomalous for the specific entity, (3) identifying a quota of allowed anomalous actions for the specific entity, (4) determining that the attempted action causes a count of anomalous actions to exceed the quota of allowed anomalous actions, and (5) performing a security action based on the determination that the attempted action causes the count of anomalous actions to exceed the quota of allowed anomalous actions. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: September 5, 2017
    Assignee: Symantec Corporation
    Inventors: Aleatha Parker-Wood, Michael Hart, Darren Shou, Chetan Verma
  • Patent number: 9721928
    Abstract: A packaged IC device in which a die is sandwiched between first and second substrates such that (i) peripheral electrical contact pads of the die are wire bonded to the first substrate, e.g., for routing functional input/output signals, and (ii) core-area electrical contact pads of the die are connected to the second substrate in a flip-chip arrangement, e.g., for routing one or more power supply voltages to the core area of the die. The second substrate has a shape and position that (i) expose the peripheral electrical contact pads of the die for unencumbered machine-implemented wire bonding during the assembly process, and (ii) enable direct electrical connections between the first and second substrates outside the footprint of the die, e.g., by way of the corresponding solder bumps attached between the two substrates.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 1, 2017
    Assignee: NXP USA, INC.
    Inventors: Navas Khan Oratti Kalandar, Lan Chu Tan, Chetan Verma
  • Publication number: 20160306967
    Abstract: A method, performed by a processor to detect malicious or risky data accesses is provided. The method includes modeling user accesses to a content repository as to probability of a user accessing data in the content repository, based on a history of user accesses to the content repository. The method includes scoring a singular user access to the content repository, based on probability of access according to the modeling and alerting in accordance with the scoring.
    Type: Application
    Filed: April 17, 2015
    Publication date: October 20, 2016
    Inventors: Michael Hart, Chetan Verma, Sandeep Bhatkar, Aleatha Parker-Wood
  • Patent number: 9418873
    Abstract: A semiconductor device has an on-die decoupling capacitor that is shared between alternative high-speed interfaces. A capacitance pad is connected to the decoupling capacitor and internal connection pads are connected respectively to the alternative interfaces. Internal connection bond wires connect the decoupling capacitor to the selected interface through the capacitance pad and the internal connection pads in the same process as connecting the die to external electrical contacts of the device.
    Type: Grant
    Filed: August 24, 2014
    Date of Patent: August 16, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Shailesh Kumar, Vikas Garg, Sumit Varshney, Chetan Verma
  • Publication number: 20160163671
    Abstract: A surface-mounted integrated circuit package containing a semiconductor die has at least two conductive plates on its lower surface for contacting power and ground areas of a printed circuit board (PCB). The conductive plates are electrically connected to metal studs encapsulated within the package and which link the plates to the power and ground grids of the semiconductor die. Power and ground can thus be provided to the package with conductive patterns on the PCB that match with the plates. The resistance of the plates is low and hence the IR drop across the die is low. By supplying power directly to the package via the plates, the peripheral package pins that would otherwise have been allocated for power (and ground) are now freed up for signal assignment.
    Type: Application
    Filed: December 3, 2014
    Publication date: June 9, 2016
    Applicant: Freescale Semiconductor, Inc.
    Inventors: SHAILESH KUMAR, Rishi Bhooshan, Chee Seng Foong, Vikas Garg, Navas Khan Oratti Kalandar, Chetan Verma
  • Patent number: 9337140
    Abstract: A semiconductor device includes a semiconductor die having opposing first and second main surfaces, contact pads and a metal ring accessible from the first main surface, and signal leads surrounding and spaced from the die. Each of the signal leads has a first end near the die, a second end remote from the die, and a body extending between the first and second ends. A dummy lead frame is disposed between the signal leads first ends and the die, and connected to a fixed potential. First bond wires are coupled to respective ones of the signal leads and the contact pads. Second, shield bond wires, located adjacent to respective ones of the bond wires, are coupled to the dummy lead frame and the metal ring.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: May 10, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Shailesh Kumar, Rishi Bhooshan, Meng Kong Lye, Sumit Varshney, Chetan Verma
  • Patent number: 9292651
    Abstract: A method of physical design of an IC using an EDA tool includes identifying elements of the IC design that have excess positive timing slack. The excess timing slack elements are placed in a separate partition and then parameters of the characteristics of the excess timing slack elements are modified to reduce their excess timing slack, such as reducing the voltage supplied to the separate partition, thereby lowering power consumption of the IC design.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: March 22, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Chetan Verma, Amit Kumar Dey, Ashis Maitra, Kulbhushan Misri, Amit Roy, Harkaran Singh, Vijay Tayal