Patents by Inventor Chetana Bhaskar
Chetana Bhaskar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220230293Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: ApplicationFiled: April 4, 2022Publication date: July 21, 2022Inventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Patent number: 11295438Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: GrantFiled: November 30, 2018Date of Patent: April 5, 2022Assignee: KLA CorporationInventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Patent number: 10395358Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.Type: GrantFiled: November 6, 2017Date of Patent: August 27, 2019Assignee: KLA-Tencor Corp.Inventors: Bjorn Brauer, Eugene Shifrin, Ashok Mathew, Chetana Bhaskar, Lisheng Gao, Santosh Bhattacharyya, Hucheng Lee, Benjamin Murray
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Publication number: 20190108630Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: ApplicationFiled: November 30, 2018Publication date: April 11, 2019Inventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Patent number: 10192303Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: GrantFiled: November 11, 2013Date of Patent: January 29, 2019Assignee: KLA Tencor CorporationInventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Publication number: 20180130199Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.Type: ApplicationFiled: November 6, 2017Publication date: May 10, 2018Inventors: Bjorn Brauer, Eugene Shifrin, Ashok Mathew, Chetana Bhaskar, Lisheng Gao, Santosh Bhattacharyya, Hucheng Lee, Benjamin Murray
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Patent number: 9262821Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.Type: GrantFiled: May 8, 2015Date of Patent: February 16, 2016Assignee: KLA-Tencor Corp.Inventors: Eugene Shifrin, Chetana Bhaskar, Ashok V. Kulkarni, Chien-Huei (Adam) Chen, Kris Bhaskar, Brian Duffy
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Publication number: 20150324964Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.Type: ApplicationFiled: May 8, 2015Publication date: November 12, 2015Inventors: Eugene Shifrin, Chetana Bhaskar, Ashok V. Kulkarni, Chien-Huei (Adam) Chen, Kris Bhaskar, Brian Duffy
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Publication number: 20140153814Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: ApplicationFiled: November 11, 2013Publication date: June 5, 2014Applicant: KLA-Tencor CorporationInventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Patent number: 8126255Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.Type: GrantFiled: September 19, 2008Date of Patent: February 28, 2012Assignee: KLA-Tencor Corp.Inventors: Kris Bhaskar, Chetana Bhaskar, Ashok Kulkarni, Eliezer Rosengaus, Cecelia Campochiaro, Chris Maher, Brian Duffy, Aneesh Khullar, Alpa Kohli, Lalita A. Balasubramanian, Santosh Bhattacharyya, Mohan Mahadevan
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Publication number: 20090080759Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.Type: ApplicationFiled: September 19, 2008Publication date: March 26, 2009Applicant: KLA-TENCOR CORPORATIONInventors: Kris Bhaskar, Chetana Bhaskar, Ashok Kulkarni, Eliezer Rosengaus, Cecilia Campochiaro, Chris Maher, Brian Duffy, Aneesh Khullar, Alpa Kohli, Lalita A. Balasubramanian, Santosh Bhattacharyya, Mohan Mahadevan
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Patent number: 5502306Abstract: There is disclosed numerous embodiments of a method and apparatus for a particle scanning system and an automatic inspection system. In each of these a particle beam is directed at the surface of a substrate for scanning that substrate. Also included are a selection of detectors to detect at least one of the secondary particles, back-scattered particles and transmitted particles from the substrate. The substrate is mounted on an x-y stage to provide it with at least one degree of freedom while the substrate is being scanned by the/particle beam. The substrate is also subjected to an electric field on it's surface to accelerate the secondary particles. The system also has the capability to accurately measure the position of the substrate with respect to the charged particle beam. Additionally, there is an optical alignment means for initially aligning the substrate beneath the,particle beam means.Type: GrantFiled: March 17, 1994Date of Patent: March 26, 1996Assignee: KLA Instruments CorporationInventors: Dan Meisburger, Alan D. Brodie, Curt Chadwick, Anil Desai, Hans Dohse, Dennis Emge, John Greene, Ralph Johnson, Ming-Yie Ling, John McMurtry, Barry Becker, Ray Paul, Mike Robinson, Richard Simmons, David E. A. Smith, John Taylor, Lee Veneklasen, Dean Walters, Paul Wieczorek, Sam Wong, April Dutta, Surendra Lele, Kirkwood Rough, Henry Pearce-Percy, Jack Y. Jau, Chun C. Lin, Hoi T. Nguyen, Yen-Jen Oyang, Timothy L. Hutcheson, David J. Clark, Chung-Shih Pan, Chetana Bhaskar, Chris Kirk, Eric Munro