Abstract: An integrated device that includes a substrate, a device level layer formed over the substrate, and interconnect portion over the device level layer. The device level layer includes a plurality of first device level cells, each first device level cell comprising a first configuration. The device level layer includes a plurality of second device level cells. At least one second device level cell includes a second configuration that is different than the first configuration. The plurality of second device level cells is located over at least one region of the integrated device comprising at least one hotspot.

Abstract: Techniques for reducing scan overhead in a scannable flop tray are described herein. In one embodiment, a scan circuit for a flop tray comprises a tri-state circuit configured to invert an input data signal and output the inverted data signal to an input of a flip-flop of the flop tray in a normal mode, and to block the data signal from the input of the flip-flop in a scan mode. The scan circuit also comprises a pass gate configured to pass a scan signal to the input of the flip-flop in the scan mode, and to block the scan signal from the input of the flip-flop in the normal mode.

Abstract: Techniques for reducing scan overhead in a scannable flop tray are described herein. In one embodiment, a scan circuit for a flop tray comprises a tri-state circuit configured to invert an input data signal and output the inverted data signal to an input of a flip-flop of the flop tray in a normal mode, and to block the data signal from the input of the flip-flop in a scan mode. The scan circuit also comprises a pass gate configured to pass a scan signal to the input of the flip-flop in the scan mode, and to block the scan signal from the input of the flip-flop in the normal mode.

Abstract: An apparatus fabricated using a standard cell architecture including devices having different voltage thresholds may include a first set of polylines associated with a first channel length, where each polyline within the first set of polylines is separated by a substantially constant pitch. The apparatus may further include a second set of polylines associated with a second channel length and aligned with the first set of polylines, where each polyline within the second set of polylines is laterally separated by the substantially constant pitch. The apparatus may further include a first active region below the first set of polylines, and a second active region below the second set of polylines, where the first active region and the second active region are separated by a distance of less than 170 nm.

Abstract: Gridded polysilicon semiconductor layouts implement double poly patterning to cut polylines of the layout into polyline segments. Devices are arranged on the polyline segments of a common polyline to reduce the area used to implement a circuit structure relative to conventional gridded polysilicon layout. Stacking of PMOS and NMOS devices is enabled by using double poly patterning to implement additional cuts which form additional polyline segments. Metal layer routing may connect nodes of separate polyline segments.

Abstract: An apparatus fabricated using a standard cell architecture including devices having different voltage thresholds may include a first set of polylines associated with a first channel length, where each polyline within the first set of polylines is separated by a substantially constant pitch. The apparatus may further include a second set of polylines associated with a second channel length and aligned with the first set of polylines, where each polyline within the second set of polylines is laterally separated by the substantially constant pitch. The apparatus may further include a first active region below the first set of polylines, and a second active region below the second set of polylines, where the first active region and the second active region are separated by a distance of less than 170 nm.