Patents by Inventor Cheul-Gyu Boo

Cheul-Gyu Boo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8376431
    Abstract: A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: February 19, 2013
    Assignee: TechWing Co., Ltd.
    Inventors: Yun Sung Na, Tae-Hung Ku, Cheul-Gyu Boo
  • Patent number: 8333083
    Abstract: A system to support the testing of electronic devices and a temperature control unit for the system are disclosed. A temperature controlling method for a chamber of the system is also disclosed. Low or high temperature air is supplied to the inside of the chamber when the electronic devices are tested at low or high temperature. External air is supplied to the inside of the chamber when the electronic devices are tested at room temperature.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: December 18, 2012
    Assignee: TechWing Co., Ltd.
    Inventors: Yun-Sung Na, Tae-Hung Ku, Cheul-Gyu Boo
  • Publication number: 20100316478
    Abstract: A pick-and-place module for test handlers is disclosed that includes a main body and a kit. The main body forms vacuum paths therein and the kit also forms vacuum passages therein. The kit is detachably mounted to the main body in a hook coupling manner. The pick-and-place module can be applied to all customer trays having different loading capabilities when only the kit of the pick-and-place module needs to be replaced, so there is no need to manufacture the entire pick-and-place module and this reduces manufacturing costs. The pick-and-place module can reduce the amount of resources to be replaced and reduce the replacement time since the kit can be easily removed from the main body of the pick-and-place module in a hook manner.
    Type: Application
    Filed: May 26, 2010
    Publication date: December 16, 2010
    Applicant: TECHWING CO., LTD.
    Inventors: Yun Sung NA, Tae-Hung KU, Cheul-Gyu BOO
  • Publication number: 20090230201
    Abstract: A system to support the testing of electronic devices and a temperature control unit for the system are disclosed. A temperature controlling method for a chamber of the system is also disclosed. Low or high temperature air is supplied to the inside of the chamber when the electronic devices are tested at low or high temperature. External air is supplied to the inside of the chamber when the electronic devices are tested at room temperature.
    Type: Application
    Filed: March 9, 2009
    Publication date: September 17, 2009
    Applicant: TECHWING CO., LTD.
    Inventors: Yun-Sung NA, Tae-Hung KU, Cheul-Gyu BOO