Abstract: A program method of a nonvolatile memory device includes a pre-program verify step for verifying a threshold voltage of a selected memory cell; a step of setting a bit line voltage of the selected memory cell according to the threshold voltage of the selected memory cell which is determined through the pre-program verify step; a step of applying a program voltage to the selected memory cell set with the bit line voltage; and a post-program verify step for verifying a programmed state of the selected memory cell applied with the program voltage.

Abstract: A semiconductor memory device includes: a memory array including a plurality of memory cells; and a peripheral circuit configured to change a voltage level of a bit line connected to a program target cell according to a threshold voltage of the program target cell among the memory cells during a program operation.

Abstract: A program method of a nonvolatile memory device includes a pre-program verify step for verifying a threshold voltage of a selected memory cell; a step of setting a bit line voltage of the selected memory cell according to the threshold voltage of the selected memory cell which is determined through the pre-program verify step; a step of applying a program voltage to the selected memory cell set with the bit line voltage; and a post-program verify step for verifying a programmed state of the selected memory cell applied with the program voltage.

Abstract: A program method of a nonvolatile memory device includes a pre-program verify step for verifying a threshold voltage of a selected memory cell; a step of setting a bit line voltage of the selected memory cell according to the threshold voltage of the selected memory cell which is determined through the pre-program verify step; a step of applying a program voltage to the selected memory cell set with the bit line voltage; and a post-program verify step for verifying a programmed state of the selected memory cell applied with the program voltage.

Abstract: The present technology relates to an electronic device, and more particularly, to a semiconductor device. The semiconductor device includes a peripheral circuit, a power output line connected to the peripheral circuit and configured to transmit an operation voltage to the peripheral circuit, a current compensator including an OP-amplifier connected to the power output line, and a capacitor connected between an output terminal of the OP-amplifier and the power output line.

Abstract: A memory includes a first memory cell, a bit line corresponding to the first memory cell, at least one second memory cell adjacent to the first memory cell, and a page buffer configured to read data of the first memory cell by precharging the bit line to a voltage level which is decided in response to data of the at least one second memory cell.

Abstract: A semiconductor memory device includes: a memory array including a plurality of memory cells; and a peripheral circuit configured to change a voltage level of a bit line connected to a program target cell according to a threshold voltage of the program target cell among the memory cells during a program operation.

Abstract: The present technology relates to an electronic device, and more particularly, to a semiconductor device. The semiconductor device includes a peripheral circuit, a power output line connected to the peripheral circuit and configured to transmit an operation voltage to the peripheral circuit, a current compensator including an OP-amplifier connected to the power output line, and a capacitor connected between an output terminal of the OP-amplifier and the power output line.

Abstract: A nonvolatile memory device including a plurality of memory cells arranged at a region where a word line and a bit line cross each other, a voltage generator configured to generate a program voltage to apply to the word line by increasing the program voltage by an increment whenever a program loop is repeated, a current sensing check unit configured to compare a number of failed memory cells among the memory cells to first and second reference values, and a control logic configured to control the voltage generator to change the increment according to the comparison result of the current sensing check unit.

Abstract: A nonvolatile memory device including a plurality of memory cells arranged at a region where a word line and a bit line cross each other, a voltage generator configured to generate a program voltage to apply to the word line by increasing the program voltage by an increment whenever a program loop is repeated, a current sensing check unit configured to compare a number of failed memory cells among the memory cells to first and second reference values, and a control logic configured to control the voltage generator to change the increment according to the comparison result of the current sensing check unit.

Abstract: A nonvolatile memory device includes a memory cell array configured to comprise a number of cell strings, a number of page buffers each coupled to the cell strings of the memory cell array through bit lines, and a bit line precharge circuit configured to precharge a selected bit line up to a voltage of a first level before one of the page buffers precharges the selected bit line.

Abstract: A memory includes a first memory cell, a bit line corresponding to the first memory cell, at least one second memory cell adjacent to the first memory cell, and a page buffer configured to read data of the first memory cell by precharging the bit line to a voltage level which is decided in response to data of the at least one second memory cell.

Abstract: A program method of a nonvolatile memory device includes a pre-program verify step for verifying a threshold voltage of a selected memory cell; a step of setting a bit line voltage of the selected memory cell according to the threshold voltage of the selected memory cell which is determined through the pre-program verify step; a step of applying a program voltage to the selected memory cell set with the bit line voltage; and a post-program verify step for verifying a programmed state of the selected memory cell applied with the program voltage.

Abstract: Disclosed are a circuit and a method for controlling redundancy in a semiconductor memory apparatus. The circuit includes a peripheral circuit redundancy control block and a memory bank redundancy control block. The peripheral circuit redundancy control block buffers and latches an external command to generate an internal command. The peripheral circuit redundancy control block also buffers and latches an external address to generate a global address by comparing the external address with a predetermined output signal of a fuse circuit. The memory bank redundancy control block receives the global address corresponding to the internal command to selectively activate a redundancy word line or a main word line, such that the fuse circuit is provided in the peripheral circuit redundancy control block.

Abstract: A duty cycle correcting circuit includes a first duty ratio correcting unit that widens a high-level period of an input clock in response to a detection signal, thereby correcting a duty ratio of the input clock to output a first corrected clock. A second duty ratio correcting unit narrows the high-level period of the input clock in response to the detection signal, thereby correcting the duty ratio of the input clock to output a second corrected clock. A clock selecting unit selectively outputs the first corrected clock or the second corrected clock as an output clock in response to the detection signal. A duty ratio detecting unit detects a duty ratio of the output clock, thereby generating the detection signal.

Abstract: A nonvolatile memory device includes a memory cell array configured to include cell strings coupled between respective bit lines and a source line, a unilateral element coupled to the source line, and a negative voltage generation unit coupled to the unilateral element and configured to generate a negative voltage.

Abstract: A page buffer circuit comprises a bit line selection unit, a latch unit, and a bit line control unit. The bit line selection unit is configured to select a bit line coupled to memory cells. The latch unit comprises a plurality of latch circuits. The plurality of latch circuits is coupled to a sense node and configured to latch data to be programmed into the memory cells or store data from the memory cells. The bit line control unit is coupled to the sense node and configured to temporarily charge a voltage of the selected bit line in response to charge and transfer control signals or transfer the charged voltage to the selected bit line.

Abstract: A duty cycle correcting circuit includes a first duty ratio correcting unit that widens a high-level period of an input clock in response to a detection signal, thereby correcting a duty ratio of the input clock to output a first corrected clock. A second duty ratio correcting unit narrows the high-level period of the input clock in response to the detection signal, thereby correcting the duty ratio of the input clock to output a second corrected clock. A clock selecting unit selectively outputs the first corrected clock or the second corrected clock as an output clock in response to the detection signal. A duty ratio detecting unit detects a duty ratio of the output clock, thereby generating the detection signal.

Abstract: Disclosed are a circuit and a method for controlling redundancy in a semiconductor memory apparatus. The circuit includes a peripheral circuit redundancy control block and a memory bank redundancy control block. The peripheral circuit redundancy control block buffers and latches an external command to generate an internal command. The peripheral circuit redundancy control block also buffers and latches an external address to generate a global address by comparing the external address with a predetermined output signal of a fuse circuit. The memory bank redundancy control block receives the global address corresponding to the internal command to selectively activate a redundancy word line or a main word line, such that the fuse circuit is provided in the peripheral circuit redundancy control block.

Abstract: A page buffer circuit comprises a bit line selection unit, a latch unit, and a bit line control unit. The bit line selection unit is configured to select a bit line coupled to memory cells. The latch unit comprises a plurality of latch circuits. The plurality of latch circuits is coupled to a sense node and configured to latch data to be programmed into the memory cells or store data from the memory cells. The bit line control unit is coupled to the sense node and configured to temporarily charge a voltage of the selected bit line in response to charge and transfer control signals or transfer the charged voltage to the selected bit line.