Abstract: One or more implementations of the subject technology may enable a bond-on-pad (BoP) substrate technology that can eliminate the need to utilize a solder-on-pad (SoP) process. Unlike an SoP process, a BoP Process does not require a solder bump to be formed on a bump pad to attach a joint to a bump pad. The size of an opening on a bump pad for a BoP process may be larger than that of an SoP process. A BoP process may use a solder mask having multiple thicknesses and may be thinner near the bump pads. A BoP process may use a joint having a copper pillar and a solder cap. A BoP process can be used with an underfill or a molding compound technology.

Abstract: The present invention is directed to semiconductor devices and manufacturing methods. According to an embodiment, the present invention provides a semiconductor have includes a circuit that is coupled to a substrate. The substrate comprises a plurality of layers, some of which comprise organic material. In some implementations, the substrate may be a coreless substrate that is free from a core material. There are other embodiments as well.

Abstract: An EM shielding structure for a semiconductor package is embedded in a through hole of a core layer of the semiconductor package. The EM shielding structure may include multiple vias formed by a copper plating operation. Additionally, a metal way surrounds the EM shielding structures and prevents, along with a dielectric material, unwanted EM radiation (passing through the vias) from emanating throughout the semiconductor package. The EM shielding structure can also take the form of an insert that is adhered to the core layer at a through hole of the core layer.

Abstract: A substrate with differing dielectric constant materials is provided. The substrate includes a first ground plane, a second ground plane, a first conductive trace, a first material having a first dielectric constant, and a second material having a second dielectric constant. The first material is disposed between the first ground plane and the first conductive trace, and the second material is disposed between the second ground plane and at least part of the first conductive trace. The first dielectric constant is different from the second dielectric constant.

Abstract: One or more implementations of the subject technology may enable a bond-on-pad (BoP) substrate technology that can eliminate the need to utilize a solder-on-pad (SoP) process. Unlike an SoP process, a BoP Process does not require a solder bump to be formed on a bump pad to attach a joint to a bump pad. The size of an opening on a bump pad for a BoP process may be larger than that of an SoP process. A BoP process may use a solder mask having multiple thicknesses and may be thinner near the bump pads. A BoP process may use a joint having a copper pillar and a solder cap. A BoP process can be used with an underfill or a molding compound technology.

Abstract: A system, device and method for the brewing of a capsule. The device comprises a first chamber portion and a second chamber portion movable with respect to each other to be moved between an open position and a closed position. The device further comprises a capsule handler arranged to enable insertion therein of the capsule and to position said capsule in a brewing position, wherein the capsule handler retains the capsule in the brewing position when the capsule handler is in a ready position. When the first chamber portion and the second chamber portion are moved with respect to each other from the closed position to the open position, the capsule can fall freely from the brewing position under the influence of gravity when the capsule handler is in an ejection position.

Abstract: Disclosed is a vehicle side wing anti-collision system, including a telescopic assembly fixed on a vehicle frame; and a collision panel located in a groove of a vehicle side body and provided correspondingly to the telescopic assembly. The groove is provided with a connection hole and the telescopic assembly is extended out of the connection hole towards two sides in a transverse direction of the vehicle to drive the collision panel to extend out of the groove till protruding from the vehicle side body when the collision panel is subjected to a collision. Through the telescopic assembly and the collision panel, protection layers are formed on two sides of the vehicle, and thus the anti-collision ability of the vehicle side wing is enhanced.

Abstract: A system, device and method for preparing a beverage using a capsule. The capsule comprises a cup-shaped body, a lid and an actuating member. The device comprises a capsule holder, a fluid supply unit, and a flow control unit arranged for controlling a parameter of the fluid to be supplied to the capsule. The flow control unit is arranged for selectively operating in one of at least a first mode and a second mode. The flow control unit comprises a switching member movable between a first and second position, and arranged for being engaged by the actuating member of the capsule. The system is arranged such that the flow control unit is in the first mode when the switching member is in the first position, and such that the flow control unit is in the second mode when the switching member is in the second position.

Abstract: Disclosed is a vehicle side wing anti-collision system, including a telescopic assembly fixed on a vehicle frame; and a collision panel located in a groove of a vehicle side body and provided correspondingly to the telescopic assembly. The groove is provided with a connection hole and the telescopic assembly is extended out of the connection hole towards two sides in a transverse direction of the vehicle to drive the collision panel to extend out of the groove till protruding from the vehicle side body when the collision panel is subjected to a collision. Through the telescopic assembly and the collision panel, protection layers are formed on two sides of the vehicle, and thus the anti-collision ability of the vehicle side wing is enhanced.

Abstract: A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.

Abstract: An integrated circuit (IC) package substrate is provided. In one embodiment, the IC package substrate includes a dielectric layer having first and second opposing surfaces and a matrix of pillars disposed in the dielectric layer and arranged to receive a matrix of conductive elements of an IC die. Each pillar of the matrix of pillars is exposed at the first surface of the dielectric layer. Each pillar of the matrix of pillars extends through the dielectric layer to contact a metal layer attached to the second surface of the dielectric layer.

Abstract: A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

Abstract: A system (1) for preparing a predetermined amount of beverage suitable for consumption, provided with an exchangeable holder (2, 102), and an apparatus (4) provided with a fluid dispensing device (6) which is detachably connected to the holder (2, 102) for dispensing at least one amount of at least a first fluid, such as water, under pressure to the exchangeable holder (2, 102), wherein the exchangeable holder (2, 102) is provided with at least one storage space (8, 108) which is filled with a second fluid, such as a concentrate, the holder (2, 102) further being provided with at least one first mixing chamber (10, 110), the exchangeable holder (2, 102) comprising a first holder part (198) and a second holder part (199), the first holder part (198) comprising a substantially flat contacting surface (166), and the at least one storage space (8, 108) and the first mixing chamber (10, 110) each comprising a wall (167, 168) offset relative to the contacting surface (166), which, each, form part of the first holde

Abstract: An integrated circuit (IC) package substrate is provided. In one embodiment, the IC package substrate includes a dielectric layer having first and second opposing surfaces and a matrix of pillars disposed in the dielectric layer and arranged to receive a matrix of conductive elements of an IC die. Each pillar of the matrix of pillars is exposed at the first surface of the dielectric layer. Each pillar of the matrix of pillars extends through the dielectric layer to contact a metal layer attached to the second surface of the dielectric layer.

Abstract: A holder and method for obtaining a holder, wherein the holder is provided with a first and a second wall part. The first and second wall part are interconnected such that therebetween at least a first storage space, at least a first fluid connection and at least a first seal removable through fluid pressure and defining an opening are formed. The at least first removable connection is communication with the first storage space and seals a communication to or from the at least first fluid connection. With the method for obtaining the holder, prior to forming the connection of the first and second wall parts, a lacquer is locally applied to one of the first and second wall parts, which after connection results in a controlled reduced adhesion for obtaining the at least first removable seal. Here in the proximity of the removable seal, an additional connection of the first wall part to the second wall part is provided.

Abstract: Embodiments described herein provide a method of manufacturing integrated circuit (IC) devices. The method includes coupling a first surface of a first intermediate substrate to a first surface of a second intermediate substrate, forming a first plurality of patterned metal layers on a second surface of the first intermediate substrate to form a first substrate and a second plurality of patterned metal layers on a second surface of the second intermediate substrate to form a second substrate, and separating the first and second substrates. Each of the first substrate and the second substrate is configured to facilitate electrical interconnection between a respective IC die and a respective printed circuit board (PCB).

Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.