Patents by Inventor Cheung-Wei Lam
Cheung-Wei Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20190393733Abstract: Wireless power transmitting devices according to embodiments of the present technology may include a contact surface configured to support one or more wireless power receiving devices. The wireless power transmitting devices may include a plurality of coils. The wireless power transmitting devices may also include a shield positioned between the plurality of coils and the contact surface. The shield may include one or more shield members, each shield member axially aligned with a separate coil of the plurality of coils, and may include a multilayer structure exhibiting various conductivities.Type: ApplicationFiled: September 28, 2018Publication date: December 26, 2019Applicant: Apple Inc.Inventors: Andro Radchenko, Vaneet Pathak, Martin Schauer, Cheung-Wei Lam, Rahul A. Sabnani
-
Publication number: 20190199144Abstract: A wireless power system uses a wireless power transmitting device to transmit wireless power to wireless power receiving devices. The wireless power transmitting device has wireless power transmitting coils that extend under a wireless charging surface. Non-power-transmitting coils and magnetic sensors may be included in the wireless power transmitting device. During wireless power transfer operations, control circuitry in the wireless power transmitting device adjusts drive signals applied to the coils to reduce ambient magnetic fields. The drive signal adjustments are made based on device type information and other information on the wireless power receiving devices and/or magnetic sensor readings from the magnetic sensors. In-phase or out-of-phase drive signals are applied to minimize ambient fields depending on device type.Type: ApplicationFiled: May 15, 2018Publication date: June 27, 2019Inventors: Jouya Jadidian, Martin Schauer, Andro Radchenko, Cheung-Wei Lam, Ketan Shringarpure, Vaneet Pathak
-
Patent number: 10256036Abstract: A system includes a circuit board, an inductor including windings mounted on the circuit board, and a plurality of magnetic field containment devices. Each magnetic field containment device includes an independent electrical circuit that is not directly electrically connected via a conductor to any other magnetic field containment device. Each magnetic field containment device also includes a material of a certain relative permeability. Each magnetic field containment device at least partially surrounds the inductor and, in operation, at least partially contains a magnetic B-Field generated by electrical current in the windings of the inductor. The plurality of magnetic field containment devices, in operation, enables a certain saturation current in the inductor.Type: GrantFiled: January 12, 2017Date of Patent: April 9, 2019Assignee: APPLE INC.Inventors: Paul A. Martinez, Ming Y. Tsai, Federico P. Centola, Martin Schauer, Cheung-Wei Lam, Jason C. Sauers
-
Patent number: 10199172Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.Type: GrantFiled: September 24, 2016Date of Patent: February 5, 2019Assignee: Apple Inc.Inventors: Paul A. Martinez, Jason C. Sauers, Cheung-Wei Lam, Federico P. Centola, Andro Radchenko, Martin Schauer
-
Publication number: 20190027298Abstract: A shield for redirecting magnetic field generated from a plurality of transmitter coils includes a ferromagnetic structure divided into segments by a plurality of boundary regions, each segment comprises a first material having a first magnetic permeability and each boundary region comprises a second material having a second magnetic permeability lower than the first magnetic permeability, where the plurality of boundary regions are configured to resist a propagation of magnetic field from a first area of the ferromagnetic structure to a second area of the ferromagnetic structure, where the first area intercepts the magnetic field generated from at least one active transmitter coil of the plurality of transmitter coils.Type: ApplicationFiled: July 24, 2017Publication date: January 24, 2019Applicant: Apple Inc.Inventors: Jouya Jadidian, Vaneet Pathak, Martin Schauer, Cheung-Wei Lam, Darshan R. Kasar, Christopher S. Graham, Andro Radchenko
-
Publication number: 20180068784Abstract: A system includes a circuit board, an inductor including windings mounted on the circuit board, and a plurality of magnetic field containment devices. Each magnetic field containment device includes an independent electrical circuit that is not directly electrically connected via a conductor to any other magnetic field containment device. Each magnetic field containment device also includes a material of a certain relative permeability. Each magnetic field containment device at least partially surrounds the inductor and, in operation, at least partially contains a magnetic B-Field generated by electrical current in the windings of the inductor. The plurality of magnetic field containment devices, in operation, enables a certain saturation current in the inductor.Type: ApplicationFiled: January 12, 2017Publication date: March 8, 2018Inventors: Paul A. Martinez, Ming Y. Tsai, Federico P. Centola, Martin Schauer, Cheung-Wei Lam, Jason C. Sauers
-
Publication number: 20170207028Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting coaxially arranged electrode layers. The capacitors may be self-shielded against electromagnetic interference with neighboring components. The capacitors may have reduced losses from fringing effects when compared to conventional capacitors. The coaxial capacitors may be two-terminal multilayer ceramic capacitors (MLCC). The design of the capacitors may facilitate an improved relationship between the electric and magnetic fields generated by the capacitor within the dielectric in some embodiments. In some embodiments, the placement of the terminals may lead to a cancelation of mutual inductances between the electrodes. Terminations that facilitate the coupling of the capacitor to a circuit board, as well as methods for fabrication of the capacitors are also discussed.Type: ApplicationFiled: September 24, 2016Publication date: July 20, 2017Inventors: Paul A. Martinez, Jason C. Sauers, Cheung-Wei Lam, Federico P. Centola, Andro Radchenko, Martin Schauer
-
Patent number: 9497054Abstract: Electronic devices may include unshielded connectors that convey radio-frequency signals with external devices. A first electronic device may include transmitter circuitry that transmits radio-frequency signals to phase shifting circuitry. The phase shifting circuitry may pass the radio-frequency signals to a first conductive contact of a connector on the first device, may generate modified signals by applying a phase shift of approximately 180 degrees to the radio-frequency signals, and may provide the modified signals to a second conductive contact on the connector. To mitigate undesirable resonance and radiation at the connector, the connector may concurrently convey the radio-frequency signals and the modified signals to an external device over the first and second contacts while mating contacts on a connector of the external electronic device are in electrical contact with the first and second conductive contacts.Type: GrantFiled: August 18, 2015Date of Patent: November 15, 2016Assignee: Apple Inc.Inventors: Tianqi Li, Cheung-Wei Lam, Vaneet Pathak
-
Patent number: 8110744Abstract: A flexible shielded cable is disclosed. The cable may include a plurality of conductors formed on a common base, a dielectric material disposed about the plurality of conductors, and a shielding material disposed adjacent the dielectric material. At least one of the plurality of conductors may include an unshielded portion not overlaid by the shielding material and at least one of the plurality of conductors may include a shielded portion overlaid by the shielding material.Type: GrantFiled: August 19, 2008Date of Patent: February 7, 2012Assignee: Apple Inc.Inventors: Suinin William Wong, Cheung-Wei Lam
-
Patent number: 7813140Abstract: The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board.Type: GrantFiled: August 18, 2008Date of Patent: October 12, 2010Assignee: Apple Inc.Inventor: Cheung-Wei Lam
-
Publication number: 20100044067Abstract: A flexible shielded cable is disclosed. The cable may include a plurality of conductors formed on a common base, a dielectric material disposed about the plurality of conductors, and a shielding material disposed adjacent the dielectric material. At least one of the plurality of conductors may include an unshielded portion not overlaid by the shielding material and at least one of the plurality of conductors may include a shielded portion overlaid by the shielding material.Type: ApplicationFiled: August 19, 2008Publication date: February 25, 2010Applicant: Apple Inc.Inventors: Suinin William Wong, Cheung-Wei Lam
-
Publication number: 20090046440Abstract: The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board.Type: ApplicationFiled: August 18, 2008Publication date: February 19, 2009Inventor: Cheung-Wei Lam
-
Patent number: 7417869Abstract: The present invention describes methods for enhancing the performance of two-capacitor low-pass filters. In certain embodiments of the invention, the capacitors are placed on opposite sides of a PCB board.Type: GrantFiled: January 13, 2005Date of Patent: August 26, 2008Assignee: Apple Inc.Inventor: Cheung-Wei Lam
-
Patent number: 7411134Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.Type: GrantFiled: March 1, 2007Date of Patent: August 12, 2008Assignee: Apple Inc.Inventors: Robert Steinfeld, Cheung-Wei Lam
-
Patent number: 7207104Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.Type: GrantFiled: September 21, 2006Date of Patent: April 24, 2007Assignee: Apple Computer, Inc.Inventors: Robert Steinfeld, Cheung-Wei Lam
-
Patent number: 7129416Abstract: Electrical mounting boards and methods for their fabrication and use are disclosed herein. In particular, such mounting boards embodiments utilize hybrid ground lines interconnected through a substrate core to form multilayer ground grids. Such hybrid ground lines include groups of substantially parallel ground lines configured such that the groups of ground lines are positioned in transverse arrangement with other groups of ground lines formed on the same level. Such implementations have many uses, including, but not limited to, the ability to more efficiently route signal lines and connect electrical components on a circuit board.Type: GrantFiled: February 5, 2004Date of Patent: October 31, 2006Assignee: Apple Computer, Inc.Inventors: Robert Steinfeld, Cheung-Wei Lam