Patents by Inventor Chew Beng Chyt

Chew Beng Chyt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040188400
    Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.
    Type: Application
    Filed: April 13, 2004
    Publication date: September 30, 2004
    Applicant: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Kian Shing Tan, Chew Beng Chyt, Tan Hock Chuan, Fong Chun Wai