Abstract: A structure for packaging semiconductor integrated circuits including a ceramic housing consisting of a base and cap having opposed mating surfaces for subsequent mating during a cap-to-base sealing operation that encapsulates an integrated circuit within the ceramic housing. Each of the base and cap mating surfaces having at least one thin sintered layer consisting of at least two sealing glass paste compositions sequentially printed onto each of the opposed mating surfaces before being sintered. The sealing glass paste compositions containing a mixture of glass powder and a liquid vehicle. A first of the compositions is characterized by having a glass-to-vehicle ratio range of 9:1 to 15:1 which is facilitated by having a liquid vehicle containing a mixture consisting of 93 wt % isotridecyl alcohol, 5 wt % diacetone acetate and 2 wt % acrylic resin and a glass powder selected from the group of LS0113, LS2001B, XS1175M, and T187 industry type glass powders.