Abstract: A light emitting diode (LED) device comprises: an interposer comprising: an interposer body, a plurality of pillars on a first surface of the interposer body, and two or more local fiducials on the first surface of the interposer body; an LED die comprising a die body and a first die surface comprising a plurality of light emitting diodes (LEDs), the LED die being mounted on the plurality of pillars; and a flux material located between each of the pillars and a second die surface of the die body, the second die surface of the die body being opposite the first die surface, there being no flux material on a fiducial surface of each of the local fiducials. Methods of manufacturing a light emitting diode (LED) devices comprise: printing a flux material onto the pillars of the interposer, attaching an LED die to the pillars, and washing away excess flux material.

Abstract: A light emitting diode (LED) device comprises: an interposer comprising: an interposer body, a plurality of pillars on a first surface of the interposer body, and two or more local fiducials on the first surface of the interposer body; an LED die comprising a die body and a first die surface comprising a plurality of light emitting diodes (LEDs), the LED die being mounted on the plurality of pillars; and a flux material located between each of the pillars and a second die surface of the die body, the second die surface of the die body being opposite the first die surface, there being no flux material on a fiducial surface of each of the local fiducials. Methods of manufacturing a light emitting diode (LED) devices comprise: printing a flux material onto the pillars of the interposer, attaching an LED die to the pillars, and washing away excess flux material.