Patents by Inventor Chew Kai Hwa

Chew Kai Hwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030007886
    Abstract: A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.
    Type: Application
    Filed: August 17, 2001
    Publication date: January 9, 2003
    Applicant: Quantum Chemical Technologies ( Singapore) Pte Ltd.
    Inventors: Chew Kai Hwa, Chih Pan Wei
  • Patent number: 5785098
    Abstract: A syringe or cartridge has a displaceable stopper located herein, and an apparatus for filling the syringe or cartridge has a reservoir for holding a flowable filling material and a plunger associated with the reservoir to exert pressure on the flowable material in the reservoir. The plunger includes at least one dispensing port defining a channel through the plunger for connection with the syringe or cartridge to be filled. The apparatus also has a pressurizer for applying pressure to the plunger.
    Type: Grant
    Filed: November 5, 1996
    Date of Patent: July 28, 1998
    Assignee: Singapore Asahi Chemical & Solder Industries Pte. Ltd.
    Inventors: Vincent Kho Yue Sern, See Soon Lee, Chew Kai Hwa