Patents by Inventor Chew Keat Lim

Chew Keat Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a heatsink device
    Patent number: 7428777
    Abstract: A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: September 30, 2008
    Assignee: Intel Corporation
    Inventors: Kai Yong Cheng, Chew Keat Lim, Teik Hua Ng
  • Heatsink device and method
    Patent number: 6937473
    Abstract: A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: August 30, 2005
    Assignee: Intel Corporation
    Inventors: Kai Yong Cheng, Chew Keat Lim, Teik Hua Ng
  • Heatsink device and method
    Publication number: 20040264134
    Abstract: A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Inventors: Kai Yong Cheng, Chew Keat Lim, Teik Hua Ng