Patents by Inventor Chew Tham Heang

Chew Tham Heang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor
    Patent number: 6599775
    Abstract: A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die (40) on the substrate (300) with bumps (45) abutting upper surfaces (310) of the raised terminal portions (305), and reflowing the assembly. During the reflow process, the raised terminal portions (305) and the bumps (45) melt and displace the filler (27) in the underfill compound (5) away from between the bumps (45) and the raised terminal portions (305). This prevents the filler (27) from forming a barrier. The molten solder forms interconnects between the pads (46) and the raised terminal portions (305).
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: July 29, 2003
    Assignee: Advanpack Solutions Pte Ltd
    Inventors: Wang Tie, Miao Ping, Chew Tham Heang
  • Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor
    Publication number: 20020173075
    Abstract: A method of forming an underfilled semiconductor package comprises the steps of: providing a substrate (300) with raised terminal portions (305), disposing underfill compound (5) with filler (27) on the substrate (300), placing a bumped semiconductor die (40) on the substrate (300) with bumps (45) abutting upper surfaces (310) of the raised terminal portions (305), and reflowing the assembly. During the reflow process, the raised terminal portions (305) and the bumps (45) melt and displace the filler (27) in the underfill compound (5) away from between the bumps (45) and the raised terminal portions (305). This prevents the filler (27) from forming a barrier. The molten solder forms interconnects between the pads (46) and the raised terminal portions (305).
    Type: Application
    Filed: May 18, 2001
    Publication date: November 21, 2002
    Inventors: Wang Tie, Miao Ping, Chew Tham Heang