Patents by Inventor Chew Theng TAI

Chew Theng TAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedding additive particles in encapsulant of electronic device
    Patent number: 9852918
    Abstract: An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
    Type: Grant
    Filed: August 26, 2015
    Date of Patent: December 26, 2017
    Assignee: Infineon Technologies AG
    Inventors: Peh Hean Teh, Jagen Krishnan, Swee Kah Lee, Poh Cheng Lim, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh
  • Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet
    Patent number: 9817079
    Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.
    Type: Grant
    Filed: July 21, 2014
    Date of Patent: November 14, 2017
    Assignee: Infineon Technologies AG
    Inventors: Choo Tian Ooi, Chew Theng Tai, Klaus Elian, Mohd Hirzarul Hafiz Mohd Tahir
  • Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
    Patent number: 9540539
    Abstract: A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: January 10, 2017
    Assignee: Infineon Technologies AG
    Inventors: Swee Kah Lee, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh, Poh Cheng Lim, Jagen Krishnan, Peh Hean Teh
  • Embedding additive particles in encapsulant of electronic device
    Publication number: 20160064298
    Abstract: An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and a plurality of capsules in the encapsulant, wherein the capsules comprise a core comprising an additive and comprise a shell, in particular a crackable shell, enclosing the core.
    Type: Application
    Filed: August 26, 2015
    Publication date: March 3, 2016
    Inventors: Peh Hean TEH, Jagen Krishnan, Swee Kah Lee, Poh Cheng Lim, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh
  • MOLDED SENSOR PACKAGE WITH AN INTEGRATED MAGNET AND METHOD OF MANUFACTURING MOLDED SENSOR PACKAGES WITH AN INTEGRATED MAGNET
    Publication number: 20160018476
    Abstract: A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.
    Type: Application
    Filed: July 21, 2014
    Publication date: January 21, 2016
    Inventors: Choo Tian Ooi, Chew Theng Tai, Klaus Elian, Mohd Hirzarul Hafiz Mohd Tahir
  • PRIMER COMPOSITION, METHOD OF FORMING A PRIMER LAYER ON A SEMICONDUCTOR DEVICE, AND METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE
    Publication number: 20150344730
    Abstract: A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 3, 2015
    Applicant: Infineon Technologies AG
    Inventors: Swee Kah LEE, Joachim MAHLER, Chew Theng TAI, Yik Yee TAN, Soon Lock GOH, Poh Cheng LIM, Jagen KRISHNAN, Peh Hean TEH