Abstract: A multichip module includes a series of light sources arranged in a planar array, separated by a distance d1 in the x-direction and d2 in the y-direction apart, or they could be spaced different distances apart which are mounted onto an aluminum oxide metal substrate. A uniform light transmissive layer being disposed over said series of light sources having a thickness t, measure from the top of the light sources. A phosphor resin being formed above this light transmissive layer. An encapsulant having a domed portion which functions as a lens, overlaying the phosphor resin to encapsulate the array of light sources. The light transmissive layer, phosphor resin layer and the encapsulant may be formed using an injection molding process.