Patents by Inventor Chew Yeek LAU

Chew Yeek LAU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MANUFACTURING PACKAGE BY SOLDERABLE OR SINTERABLE METALLIC CONNECTION STRUCTURE APPLIED ON SACRIFICIAL CARRIER
    Publication number: 20230335516
    Abstract: A method of manufacturing a package is disclosed. In one example, the method comprises applying a metallic connection structure, which comprises a solder or sinter material, on a sacrificial carrier. An electronic component is mounted on the metallic connection structure. At least part of the electronic component and of the metallic connection structure is encapsulated. Thereafter, the sacrificial carrier is removed to thereby expose at least part of the metallic connection structure.
    Type: Application
    Filed: March 23, 2023
    Publication date: October 19, 2023
    Applicant: Infineon Technologies AG
    Inventors: Chee Yang NG, Chew Yeek LAU, Swee Kah LEE, Joseph Victor SOOSAI PRAKASAM, Hui Khin TAN