Patents by Inventor Chewen TSAI

Chewen TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200176362
    Abstract: A display panel, a display module, and an electronic device are provided. The display panel includes a flexible substrate. The flexible substrate includes a bending portion, and a position of the bending portion corresponds to a position of a bending area of the display panel. The bending portion is provided with at least one buffer hole, and a buffer material is provided in the buffer hole and on a rear surface of the bending portion.
    Type: Application
    Filed: January 4, 2019
    Publication date: June 4, 2020
    Inventor: Chewen TSAI
  • Patent number: 10651120
    Abstract: A display panel, a display module, and an electronic device are provided. The display panel includes a flexible substrate. The flexible substrate includes a bending portion, and a position of the bending portion corresponds to a position of a bending area of the display panel. The bending portion is provided with at least one buffer hole, and a buffer material is provided in the buffer hole and on a rear surface of the bending portion.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: May 12, 2020
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Chewen Tsai
  • Publication number: 20190129268
    Abstract: A display panel motherboard and a cutting method for the display panel motherboard are provided in the present disclosure. The display panel motherboard includes a rigid substrate, a flexible substrate, and a fixing layer. The flexible substrate including a cutting region and a non-cutting region; the flexible substrate in the non-cutting region is adhered to the rigid substrate; and the fixing layer is disposed between the flexible substrate in the cutting region and the rigid substrate, the fixing layer is configured to fix the flexible substrate on the rigid substrate when the flexible substrate in the non-cutting region and the rigid substrate are stripped off, and the flexible substrate is cut along the cutting region of the flexible substrate. The method is achieved by disposing a fixing layer between the flexible substrate in the cutting region and the rigid substrate of the display panel motherboard, to increase cutting efficiency.
    Type: Application
    Filed: November 24, 2017
    Publication date: May 2, 2019
    Inventors: Xiaoguang ZHU, Chewen TSAI, Mengqi CAI