Patents by Inventor CHE-YU LIU

CHE-YU LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Deep ultraviolet light-emitting diode chip and package structure containing the same
    Patent number: 9812608
    Abstract: A deep UV LED chip includes a light-emitting unit, an electrode unit, an electron blocking layer, and an optical layer. The electron blocking layer is disposed between a multiple quantum well layer and a p-type aluminum gallium nitride layer of the light-emitting unit. The optical layer is formed on the light-emitting unit and has a refractive index ranging from 1.0 to 2.3. Another deep UV LED chip further includes a light-transmitting substrate. The optical layer is formed on the light-transmitting substrate and has a refractive index ranging from 1.0 to a refractive index of the light-transmitting substrate. A package structure containing the deep UV LED chip is also disclosed.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: November 7, 2017
    Assignees: Lite-On Opto Technology (Changzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Kuo-Ming Chiu, Meng-Sung Chou, Hao-Chung Kuo, Che-Yu Liu
  • DEEP ULTRAVIOLET LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE CONTAINING THE SAME
    Publication number: 20170271550
    Abstract: A deep UV LED chip includes a light-emitting unit, an electrode unit, an electron blocking layer, and an optical layer. The electron blocking layer is disposed between a multiple quantum well layer and a p-type aluminum gallium nitride layer of the light-emitting unit. The optical layer is formed on the light-emitting unit and has a refractive index ranging from 1.0 to 2.3. Another deep UV LED chip further includes a light-transmitting substrate. The optical layer is formed on the light-transmitting substrate and has a refractive index ranging from 1.0 to a refractive index of the light-transmitting substrate. A package structure containing the deep UV LED chip is also disclosed.
    Type: Application
    Filed: September 7, 2016
    Publication date: September 21, 2017
    Inventors: KUO-MING CHIU, MENG-SUNG CHOU, HAO-CHUNG KUO, CHE-YU LIU