Patents by Inventor Chi-An JEN

Chi-An JEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170489
    Abstract: A circuit includes a base silicon layer, a base oxide layer, a first top silicon layer, a second top silicon layer, a first semiconductor device, and a second semiconductor device. The base oxide layer is formed over the base silicon layer. The first top silicon layer is formed over a first region of the base oxide layer and has a first thickness. The second top silicon layer is formed over a second region of the base oxide layer and has a second thickness less than the first thickness. The first semiconductor device is formed over the first top silicon layer and the second semiconductor device is formed over the second top silicon layer. The ability to fabricate a top silicon layers with differing thicknesses can provide a single substrate having devices with different characteristics, such as having both fully depleted and partially depleted devices on a single substrate.
    Type: Application
    Filed: January 29, 2024
    Publication date: May 23, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Gulbagh Singh, Kuan-Liang Liu, Wang Po-Jen, Kun-Tsang Chuang, Hsin-Chi Chen
  • Publication number: 20240156970
    Abstract: This disclosure relates generally to Neisseria surface moieties. More particularly, the present disclosure relates to oligosaccharides corresponding to Neisseria lipooligosaccharides and to chimeric molecules comprising these moieties for eliciting an immune response to Neisseria organisms and/or for treating or inhibiting the development of Neisseria infections.
    Type: Application
    Filed: March 14, 2022
    Publication date: May 16, 2024
    Inventors: Michael Jennings, Feda (En-Chi) Jen, Kate Seib, Evegny Semchenko, Milton Kiefel, Michael Apicella
  • Publication number: 20240162169
    Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.
    Type: Application
    Filed: December 12, 2023
    Publication date: May 16, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
  • Publication number: 20240151999
    Abstract: A cholesterol liquid crystal display device integrated with solar modules includes a first transparent substrate, a second transparent substrate, a first cholesterol liquid crystal module and a solar module. The first cholesterol liquid crystal module is arranged between the first transparent substrate and the second transparent substrate. The solar module is arranged between the first transparent substrate and the first cholesterol liquid crystal module. Therefore, the cholesterol liquid crystal display device of the present invention does not need a backlight module. By combining the light transmission characteristics of the cholesterol liquid crystal display device with the coating process characteristics of the solar module, the cholesterol liquid crystal display device with energy conservation and environmental protection is formed.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 9, 2024
    Inventors: NIEN-CHIEH WANG, YAO-JEN HSIEH, CHI-CHANG LIAO
  • Patent number: 11964406
    Abstract: A lockable rotary cutting mat includes a base plate and a rotary plate. The central bottom portion of the rotary plate is assembled on the center of the base plate through a rotary connector. The rotary plate includes a cutting surface and a periphery. The periphery is formed with concave edge portions, and a locking component is provided at the corresponding position between the base plate and the rotary plate periphery. The locking component includes a moving base, a controller and a locking edge portion. The controller can be pushed along a movement guiding axis on the moving base. The locking edge portion is connected to, and can be driven by the controller to have locked and released positions. When the locking edge portion is at the locked position, it is aligned to, and is engaged with the corresponding concave edge portion, so that the rotary plate is fixed.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: April 23, 2024
    Inventor: Chi-Jen Chen
  • Publication number: 20240109955
    Abstract: Disclosed are antigen binding polypeptides and antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural and/or functional features. Also disclosed are polynucleotides and vectors encoding such polypeptides and polypeptide complexes; host cells, pharmaceutical compositions and kits containing such polypeptides and polypeptide complexes; and methods of using such polypeptides and polypeptide complexes.
    Type: Application
    Filed: June 30, 2023
    Publication date: April 4, 2024
    Inventors: Juan LI, Chi-Jen WEI, Ronnie R. WEI, Zhi-Yong YANG, John R. MASCOLA, Gary J. NABEL, John MISASI, Amarendra PEGU, Lingshu WANG, Tongqing ZHOU, Misook CHOE, Olamide K. OLONINIYI, Bingchun ZHAO, Yi ZHANG, Eun Sung YANG, Man CHEN, Kwanyee LEUNG, Wei SHI, Nancy J. SULLIVAN, Peter D. KWONG, Richard A. KOUP, Barney S. GRAHAM, Peng HE
  • Publication number: 20240100147
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Application
    Filed: November 3, 2023
    Publication date: March 28, 2024
    Inventors: Chi-Huey WONG, Hsin-Yu LIAO, Shih-Chi WANG, Yi-An KO, Kuo-I LIN, Che MA, Ting-Jen CHENG
  • Patent number: 11918641
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 5, 2024
    Assignee: ACADEMIA SINICA
    Inventors: Chi-Huey Wong, Hsin-Yu Liao, Shih-Chi Wang, Yi-An Ko, Kuo-I Lin, Che Ma, Ting-Jen Cheng
  • Patent number: 11919886
    Abstract: The present disclosure provides compounds of Formulas (I), (II), and pharmaceutically acceptable salts thereof. The compounds described herein are useful in treating proliferative diseases, for example, cancer (e.g., lung cancer), and infectious diseases (e.g., bacterial infections).
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: March 5, 2024
    Assignees: Academia Sinica, National Taiwan University
    Inventors: Chi-Huey Wong, Pan-Chyr Yang, Rong-Jie Chein, Szu-Hua Pan, Ting-Jen R. Cheng
  • Patent number: 11881459
    Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: January 23, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
  • Patent number: 11879272
    Abstract: A lock mechanism including a main body, a base, a rotating component and a position limiting component is provided. The base is slidably connected to the main body, and the main body is sleeved on the base. The rotating component is pivoted to the main body, and the rotating component is configured to drive the base to slide relative to the main body. The position limiting component is coupled to the rotating component so as to lock the rotating component with one of the main body and the base. A holding structure of an electronic device is also provided.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: January 23, 2024
    Assignee: Wistron Corporation
    Inventors: Meng-Chian Shiu, Chi-Jen Lo
  • Patent number: 11865228
    Abstract: The present invention discloses a bone void filler and a method for manufacturing the same by natural calcium-containing waste, which comprises steps of mixing 5-20 wt % of a calcium-containing waste powder, 5-20 wt % of acetic acid and a remaining weight percentage of water uniformly to obtain a mixing solution; adding 5-20 vol % of a diammonium hydrogen phosphate solution to the mixing solution to obtain a suspension; controlling a pH value of the suspension to obtain an alkaline solution; leaving the alkaline solution at room temperature for precipitation for 0.1 to 72 hours, centrifuging or suction filtrating the alkaline solution to obtain a precipitate, drying and grinding the precipitate to obtain hydroxyapatite; and mixing 30-60 wt % of a pore former and 30-60 wt % of the hydroxyapatite and a remaining weight percentage of a binder uniformly to form a mixture, compression molding the mixture in a mold and sintering the compression-molded mixture.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: January 9, 2024
    Assignee: National University Of Kaohsiung
    Inventors: Wen-Fu Ho, Hui-Chun Yu, Shih-Ching Wu, Hsueh-Chuan Hsu, Chi-Jen Chung, Shih-Kuang Hsu
  • Publication number: 20230365903
    Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Publication number: 20230355591
    Abstract: An oral pharmaceutical formulation containing an effective amount of NRC-AN-019 including its pharmaceutically acceptable salts and polymorphs thereof, by dispersing in a polymer system in a final state of subdivision to enhance oral bioavailability. It also compositions for the treatment of Chronic Myeloid Leukemia and other tumors such as head and neck cancer, prostate cancer and the like.
    Type: Application
    Filed: January 8, 2021
    Publication date: November 9, 2023
    Inventors: Chi-Jen HONG, Yen-Fu CHEN, Cheng-Ho CHUNG
  • Patent number: 11805615
    Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.
    Type: Grant
    Filed: July 17, 2022
    Date of Patent: October 31, 2023
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 11785778
    Abstract: A multi-gate ferroelectric memory comprises a fin-shaped channel layer, a front ferroelectric layer disposed on one side of the fin-shaped channel layer, a back ferroelectric layer disposed on another side of the fin-shaped channel layer, a front gate attached to the front ferroelectric layer and away from the fin-shaped channel layer, wherein the front gate is configured to connect a word line, and a back gate attached to the back ferroelectric layer and away from the fin-shaped channel layer, wherein the back gate is configured to connect a bit line. The present disclosure further discloses a memory array device, comprises a plurality of the multi-gate ferroelectric memories arranged as an array, a plurality of word lines and a plurality of bit lines.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: October 10, 2023
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Darsen Duane Lu, Chi-Jen Lin
  • Patent number: 11773353
    Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: October 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pinlei Edmund Chu, Chun-Wei Hsu, Ling-Fu Nieh, Chi-Jen Liu, Liang-Guang Chen, Yi-Sheng Lin
  • Publication number: 20230294237
    Abstract: A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 21, 2023
    Inventors: Yi-Sheng LIN, Chi-Hsiang SHEN, Chi-Jen LIU, Chun-Wei Hsu, Yang-Chun CHENG, Kei-Wei CHEN
  • Publication number: 20230298949
    Abstract: In-situ defect count detection in post chemical mechanical polishing (post-CMP) is provided. Post-CMP is performed, in-situ and according to a recipe, on a surface of a semiconductor wafer within a post-CMP chamber. A light signal is scanned over a target area of the surface of the semiconductor wafer and a reflected light signal reflected from the target area is detected. A defect count of defects present in the target area is determined based on the reflected light signal reflected from the target area.
    Type: Application
    Filed: March 16, 2022
    Publication date: September 21, 2023
    Inventors: Chun-Hung LIAO, Jeng-Chi LIN, Chi-Jen LIU, Liang-Guang CHEN, Huang-Lin CHAO
  • Patent number: D1001796
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: October 17, 2023
    Assignee: QUANTA COMPUTER INC
    Inventors: Wen-Hung Tsai, Gwo-Chyuan Chen, Chi-Jen Yu, I-Chi Chen