Patents by Inventor Chi An

Chi An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11417739
    Abstract: Methods for forming contacts to source/drain regions and gate electrodes in low- and high-voltage devices and devices formed by the same are disclosed. In an embodiment a device includes a first channel region in a substrate adjacent a first source/drain region; a first gate over the first channel region; a second channel region in the substrate adjacent a second source/drain region, a top surface of the second channel region being below a top surface of the first channel region; a second gate over the second channel region; an ILD over the first gate and the second gate; a first contact extending through the ILD and coupled to the first source/drain region; and a second contact extending through the ILD, coupled to the second source/drain region, and having a width greater a width of the first contact and a height greater than a height of the first contact.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Meng-Han Lin, Sai-Hooi Yeong, Chi On Chui
  • Patent number: 11417566
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first metal layer over a substrate, forming a dielectric layer over the first metal layer. The method includes forming a trench in the dielectric layer, and performing a surface treatment process on a sidewall surface of the trench to form a hydrophobic layer. The hydrophobic layer is formed on a sidewall surface of the dielectric layer. The method further includes depositing a metal material in the trench and over the hydrophobic layer to form a via structure.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Hao Kung, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang, Kei-Wei Chen
  • Patent number: 11414447
    Abstract: Provided is a platinum complex having a structure represented by formula (I): wherein A1 to A3 each independently represent a 5-membered or 6-membered unsaturated ring, A3 is optionally formed between A1 and A2; X1, X2, and X3 each independently represent carbon or nitrogen; R1 represents hydrogen, substituted or unsubstituted C1-C6 alkyl, —CF2H, —CFH2, substituted or unsubstituted C6-C12 aryl or —CmF2m+1, m is an integer of 1 to 5; R2 and R3 each independently represent hydrogen, C1-C12 alkyl, substituted or unsubstituted C1-C6 alkoxyl, substituted or unsubstituted C6-C12 aryl, or —CnF2n+1, n is an integer of 0 to 3; p and q each independently represent an integer of 1 to 2; and when p or q is equal to 2, two R2's or R3's may join to form a C3-C8 aromatic or nitrogen-containing heteroaromatic ring.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: August 16, 2022
    Assignees: National Tsing Hua University, City of University of Hong Kong
    Inventors: Yun Chi, Sheng-Fu Wang, Li-Wen Fu
  • Patent number: 11416110
    Abstract: An interactive system is provided. The interactive system includes an electronic device, a first image display device and a second image display device. The electronic device transmits a first image information to the first image display device for display. The electronic device transmits a second image information to the second image display device for display. Through the second image display device, a three-dimensional second image information is displayed in a space on one side of the second image display device. The three-dimensional second image information at least interacts with an object.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: August 16, 2022
    Assignee: LIXEL INC.
    Inventors: Chun-Hsiang Yang, Chih-Hung Ting, Kai-Chieh Chang, Der-Jang Yu, Wen-Chi Lin
  • Patent number: 11416039
    Abstract: A complex moving/rotating pivot shaft device is applicable to a double-screen or flexible screen to minify the assembling/moving space of the components. The complex moving/rotating pivot shaft device includes an assembly of a fixing seat and a moving module. The moving module includes an operation arm, a guide section disposed on the operation arm and a bridge unit disposed between the operation arm and the fixing seat. The bridge unit has a shaft pillar, a reciprocally movable bolt and a guiding section in cooperation with the guide section, whereby the operation arm can move along the guiding section to reach a set position. Thereafter, the operation arm can rotate around the shaft pillar of the bridge unit to achieve opening/closing effect.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: August 16, 2022
    Assignee: Fositek Corp.
    Inventors: An Szu Hsu, Way Han Dai, Chr Chi Liu
  • Patent number: 11414026
    Abstract: A fixing frame is used for supporting an in-vehicle computer and includes a horizontal portion, a vertical portion, a side wall portion, and a connecting portion. The vertical portion is perpendicularly connected to the horizontal portion. The side wall portion is perpendicularly connected to the horizontal portion and the vertical portion. The connecting portion is connected to the horizontal portion opposite to the vertical portion and has a free end. The free end is located above the vertical portion. Therein, the fixing frame supports the in-vehicle computer through the vertical portion and the free end which are fixedly connected to a casing of the in-vehicle computer.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: August 16, 2022
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventor: Chi-Cheng Hsiao
  • Patent number: 11417633
    Abstract: An embodiment includes a first package component including a first integrated circuit die and a first encapsulant at least partially surrounding the first integrated circuit die. The device also includes a redistribution structure on the first encapsulant and coupled to the first integrated circuit die. The device also includes a first thermal module coupled to the first integrated circuit die. The device also includes a second package component bonded to the first package component, the second package component including a power module attached to the first package component, the power module including active devices. The device also includes a second thermal module coupled to the power module. The device also includes a mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Hua Yu, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 11415457
    Abstract: The present invention provides a vibration sensor, which comprises a circuit board having an accommodating space. A sensing assembly is disposed in the accommodating space. A recess for magnet sliding is disposed in the sensing assembly. Dispose a magnet in the recess and then dispose a coil layer on an arbitrary side or both sides of the sensing assembly. Furthermore, a lubricating layer is coated on the recess. Alternatively, the recess can be a vacuum structure or a hollow cross-sectional structure for reducing the friction between the recess and the magnet. Alternatively, the coil layer can be coated with a protective layer or multiple layers can be stacked. Without increasing the area of the sensor, the sensing on the variation of magnetic flux can be improved. Accordingly, the vibration sensor according to the present invention can achieve wideband detection of vibrations.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: August 16, 2022
    Assignee: National Applied Research Laboratories
    Inventors: Yu-Sheng Lai, Jui-Min Liu, Hsu-Chun Cheng, Mei-I Li, Chun-Chi Chen, Cheng-San Wu, Jia-Min Shieh
  • Patent number: 11414411
    Abstract: The present invention provides a process of synthesizing 1-(((Z)-(1-(2-aminothiazol-4-yl)-2-oxo-2-(((3S,4R)-2-oxo-4-((2-oxooxazolidin-3-yl)methyl)-1-sulfoazetidin-3 yl)amino)ethylidene)amino)oxy)cyclopropanecarboxylic acid (referred to herein as Compound X), or a salt thereof, or a solvate including hydrate thereof, and/or intermediates thereof, and the use of intermediates for preparing Compound X. In particular, the process relates to the preparation of Compound X using dynamic kinetic resolution (DKR) and asymmetric catalytic reduction, thereby providing an improved route to 1-(((Z)-(1-(2-aminothiazol-4-yl)-2-oxo-2-(((3S,4R)-2-oxo-4-((2-oxooxazolidin-3-yl)methyl)-1-sulfoazetidin-3 yl)amino)ethylidene)amino)oxy)cyclopropanecarboxylic acid (Compound X) and compositions containing said compound, including the arginine salt, sodium salt and hydrated solid forms of Compound X.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 16, 2022
    Assignee: Novartis AG
    Inventors: Like Chen, Chi Ming Cheung, Zhongbo Fei, Qun Jiang, Lei Li, Bin Li, Thomas Ruch, Hao Wang, Quanbing Wu
  • Patent number: 11417638
    Abstract: A semiconductor structure includes a semiconductor package and a connector. The semiconductor package includes a die and a redistribution structure. The redistribution structure is disposed over the die, and includes a plurality of conductive patterns stacking on one another and electrically connected to the die. The connector is disposed on the redistribution structure, and includes a connecting element. The connecting element penetrates the conductive patterns and is electrically connected to the die.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: August 16, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo
  • Patent number: 11413237
    Abstract: The present disclosure discloses a skin penetration enhancing composition and a use thereof in preparation of a skin delivery formulation. The skin penetration enhancing composition comprises sponge spicules and nanoparticles. The nanoparticles comprise at least one of one or more drugs or one or more cosmetic active ingredients.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: August 16, 2022
    Assignee: Xiamen University
    Inventors: Ming Chen, Dexiang Wang, Chunyun Liu, Saiman Zhang, Chi Zhang
  • Patent number: 11417567
    Abstract: Conductive cap-based approaches for conductive via fabrication is described. In an example, an integrated circuit structure includes a plurality of conductive lines in an ILD layer above a substrate. Each of the conductive lines is recessed relative to an uppermost surface of the ILD layer. A plurality of conductive caps is on corresponding ones of the plurality of conductive lines, in recess regions above each of the plurality of conductive lines. A hardmask layer is on the plurality of conductive caps and on the uppermost surface of the ILD layer. The hardmask layer includes a first hardmask component on and aligned with the plurality of conductive caps, and a second hardmask component on an aligned with regions of the uppermost surface of the ILD layer. A conductive via is in an opening in the hardmask layer and on a conductive cap of one of the plurality of conductive lines.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: August 16, 2022
    Assignee: Intel Corporation
    Inventors: Florian Gstrein, Eungnak Han, Rami Hourani, Ruth A. Brain, Paul A. Nyhus, Manish Chandhok, Charles H. Wallace, Chi-Hwa Tsang
  • Patent number: 11418193
    Abstract: A key unit and a keyboard using the same are provided. The key unit includes a circuit board, an elastic element, a keycap, and a processing circuit. The circuit board includes a capacitance sensing circuit embedded therein, and the capacitance sensing circuit includes a pair of sensor electrodes. The elastic element is disposed on the circuit board. The keycap is moveably disposed above and spaced apart from the circuit board. The elastic element is disposed between the keycap and the circuit board so that the keycap moves between a non-depressed position and a depressed position with respect to the circuit board. The processing circuit is electrically connected to the pair of sensor electrodes to obtain a variation of a coupling capacitance between the pair of sensor electrodes and to determine whether the keycap is touched or depressed according to the variation of coupling capacitance.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: August 16, 2022
    Assignee: PIXART IMAGING INC.
    Inventors: Che-Chia Hsu, Yu-Han Chen, Chi-Chieh Liao
  • Patent number: 11418277
    Abstract: Provided is an optical communication system configured as an optical ring network including: a first optical communication device configured to transmit a first optical signal having a first wavelength in a first direction, and to transmit a second optical signal having a second wavelength in a second direction opposite to the first direction; and a second optical communication device configured to generate a first reflected signal by reflecting the first optical signal when the first optical signal is received, to generate a second reflected signal by reflecting the second optical signal when the second optical signal is received, and to transmit the first and second reflected signals to the first optical communication device, wherein the first optical communication device analyzes a connection state of the second optical communication device based on the first and second reflected signals.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: August 16, 2022
    Assignee: SOLiD, INC.
    Inventors: Chi Young Park, Gil Koog Kim, Bum Soo Park
  • Publication number: 20220252355
    Abstract: The present invention reveals a manufacturing method of a fluororesin bundle having a plurality of fluororesin tube hold by a fixing element as a bundle. The bundle is pre-sealed when the ends of the fluororesin tubes are heated to a status being deformable and mount on the fixing element while being place in a vacuum environment and receive a thermal energy. Immersing the pre-sealed bundle into a heating pool to extend the mounted surface between the fluororesin tubes and the fixing element. Thus, a high quality fluororesin bundle can be done by using the above processes.
    Type: Application
    Filed: January 18, 2022
    Publication date: August 11, 2022
    Inventors: Chiao-Sheng Ho, Chih-Cheng Chang, Chi-Hua Wu
  • Publication number: 20220254705
    Abstract: The present disclosure is related to a lead frame structure. The lead frame structure includes a bottom board and a blocking wall. The bottom board has a first conductive portion and a second conductive portion. The first conductive portion separates from the second conductive portion. The first and second conductive portions are configured to electrically connect to a light source. The blocking wall is located on the bottom board, and the blocking wall surrounds an opening. The first and the second conductive portions are exposed from the opening. The first and the second conductive portions each have an extending portion. The extending portion extends beyond an external surface of the blocking wall in a horizontal direction.
    Type: Application
    Filed: April 14, 2021
    Publication date: August 11, 2022
    Inventors: Jian-Tsai CHANG, Chin-Jui YU, Chun-Hsiung WANG, Wei-Chi LIN
  • Publication number: 20220255697
    Abstract: A method for determining a reference signal sequence, a terminal device, and a network device, the including receiving, by a terminal device, first indication information sent by a network device, determining, by the terminal device, a target resource based on the first indication information, determining, by the terminal device, a reference signal sequence based on parameters of a first bandwidth and parameters of a second bandwidth, and sending or receiving, by the terminal device, the reference signal sequence on the target resource.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 11, 2022
    Inventors: Ming Wu, Hao Tang, Chi Zhang, Mengying Ding
  • Publication number: 20220253102
    Abstract: A notebook computer includes a base, a first display device, a second display device and a camera. A first side of the first display device is pivotally connected to the base and the second display device is pivotally connected to a second side of the first display device, wherein the first side is opposite to the second side. The camera is disposed on the second display device. The second display device rotates with respect to the first display device to adjust an angle and a height of the camera.
    Type: Application
    Filed: March 9, 2021
    Publication date: August 11, 2022
    Inventors: Chun-Chi Lin, Szu-Yu Huang, Tong-Ting Wei, Kuan-Wei Lee, Jui-Hsiang Chen
  • Publication number: 20220255190
    Abstract: The present invention relates to a bus bar for connecting an electrode lead and a battery module comprising same. The bus bar has a surface structure having a concavity and convexity pattern aligned in one direction on a connection part with an electrode lead, and thus the weldability with the electrode lead can be enhanced.
    Type: Application
    Filed: July 31, 2020
    Publication date: August 11, 2022
    Applicant: LG Energy Solution, Ltd.
    Inventors: Kyung Mo Kim, Jeong Oh Moon, Jung Hoon Lee, Ho June Chi, Jin Yong Park, Hee Jun Jin, Jhin Ha Park
  • Publication number: 20220254678
    Abstract: Some embodiments relate to a semiconductor structure including a conductive wire disposed within a first dielectric structure. An etch stop layer overlies the first dielectric structure. A dielectric capping layer is disposed between an upper surface of the conductive wire and the etch stop layer. An upper dielectric layer is disposed along sidewalls of the conductive wire and an upper surface of the etch stop layer. The upper dielectric layer contacts an upper surface of the dielectric capping layer and has a top surface vertically above the etch stop layer.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Inventors: Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee, Ting-Ya Lo