Patents by Inventor Chi-Back Ryu
Chi-Back Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230299456Abstract: The present invention relates to an antenna RF module, an RF module assembly, and an antenna device including same. Particularly, the present invention comprises an RF filter which has at least four outer side surfaces, a radiation element module which is disposed on one surface of the outer side surfaces of the RF filter, an amplifier substrate which is disposed on another surface of the outer side surfaces of the RF filter and on which an analogue amplification element is mounted, and a reflector which is disposed between the RF filter and the radiation element module to ground (GND) the radiation element module and also mediate the outwardly dissipating heat generated by the RF filter, wherein socket pins are coupled to a main board disposed at an antenna housing in a unit of a module.Type: ApplicationFiled: April 19, 2023Publication date: September 21, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
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Publication number: 20230291117Abstract: The present disclosure relates to an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a front surface of the RF filter, at least one reflector grill pin arranged between the RF filter and the radiation element module and grounding (GND) the radiation element module, outside air being introduced from in front of the RF filter to in back of the RF filter or being discharged from in back of the RF filter to in front of the RF filter through the at least one reflector grill pin, and a radome combined with the front surface of the RF filter and protecting the radiation element module from the outside.Type: ApplicationFiled: May 18, 2023Publication date: September 14, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Seong Min AHN, Jae Eun KIM, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU
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Publication number: 20230282978Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a first side of the RF filter, and a reflector arranged between the RF filter and the radiation element module in such a manner as to ground (GND) the radiation element module and, at the same time, to serve as an intermediary for dissipating heat generated in the RF filter to the outside. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The advantage of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 23, 2023Publication date: September 7, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
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Publication number: 20230253693Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 14, 2023Publication date: August 10, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
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Publication number: 20230253695Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF filter, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 16, 2023Publication date: August 10, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
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Publication number: 20230253694Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 16, 2023Publication date: August 10, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
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Publication number: 20230187807Abstract: The present invention relates to an antenna device, comprising: a front housing including antenna arrangement units in which at least one radiation element is disposed on the front sides thereof, and heat dissipation units formed between adjacent antenna arrangement units and being exposed to outside air to transfer heat generated from the rear side to the front; and a rear housing coupled to the front housing and provided with a filter for filtering RF signals and a main board on which an RF element is mounted, wherein the heat generated from the filter is transferred to the front of the front housing through the contact with the back surface of the front housing by using the filter as a heat transfer medium.Type: ApplicationFiled: February 10, 2023Publication date: June 15, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Seong Man KANG, Oh Seog CHOI, Yong Won SEO, Hyoung Seok YANG
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Publication number: 20230109083Abstract: The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.Type: ApplicationFiled: December 5, 2022Publication date: April 6, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Bae Mook JEONG
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Publication number: 20230099375Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.Type: ApplicationFiled: December 5, 2022Publication date: March 30, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Kyu Chul CHOI, Hye Yeon KIM, In Hwa CHOI, Jae Ho JANG, Jae Hyun PARK, Youn Jun CHO, Jeong Hyun CHOI
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Publication number: 20230090243Abstract: A PCB assembly is disclosed herein. An embodiment of the present disclosure provides a printed circuit board (PCB) assembly on which a plurality of devices is mounted, including: a power supply area disposed at one side of a main printed circuit board; a first area positioned in another direction of the main printed circuit board from the power supply area and including the plurality of devices; a second area positioned in another direction of the main printed circuit board from the first area and including the plurality of devices; a third area positioned in another direction of the main printed circuit board from the second area and including the plurality of devices; and a bridge printed circuit board receiving power from the power supply area and disposed vertically to the main printed circuit board, wherein the bridge printed circuit board crosses the first area, the second area, and the third area, and transmits power and a signal to at least one area.Type: ApplicationFiled: November 25, 2022Publication date: March 23, 2023Applicant: KMW INC.Inventors: Kyo Sung JI, Chi Back RYU, Bae Mook JEONG, Min Seon YUN
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Publication number: 20230080727Abstract: An RF connector is disclosed herein.Type: ApplicationFiled: November 23, 2022Publication date: March 16, 2023Applicant: KMW INC.Inventors: Kyo Sung JI, Chi Back RYU, Bae Mook JEONG, Joung-hoe KIM
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Publication number: 20230047942Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.Type: ApplicationFiled: October 28, 2022Publication date: February 16, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jae Hyun PARK, Kyo Sung JI, Hye Yeon KIM, Chi Back RYU, Jeong Hyun CHOI, Jae Ho JANG
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Patent number: D966240Type: GrantFiled: October 19, 2020Date of Patent: October 11, 2022Assignee: KMW INC.Inventors: Duk Yong Kim, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jae Hyun Park, Kyo Sung Ji, Hye Yeon Kim, Chi Back Ryu, Jeong Hyun Choi
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Patent number: D966241Type: GrantFiled: October 19, 2020Date of Patent: October 11, 2022Assignee: KMW INC.Inventors: Duk Yong Kim, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jae Hyun Park, Kyo Sung Ji, Hye Yeon Kim, Chi Back Ryu, Jeong Hyun Choi
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Patent number: D985545Type: GrantFiled: June 4, 2021Date of Patent: May 9, 2023Assignee: KMW INC.Inventors: Kyo Sung Ji, Chi Back Ryu, Min Soo Kim
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Patent number: D985546Type: GrantFiled: June 4, 2021Date of Patent: May 9, 2023Assignee: KMW INC.Inventors: Kyo Sung Ji, Chi Back Ryu, Min Soo Kim
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Patent number: D986230Type: GrantFiled: June 4, 2021Date of Patent: May 16, 2023Assignee: KMW INC.Inventors: Kyo Sung Ji, Chi Back Ryu, Min Soo Kim
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Patent number: D989049Type: GrantFiled: June 4, 2021Date of Patent: June 13, 2023Inventors: Kyo Sung Ji, Chi Back Ryu, Min Soo Kim
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Patent number: D995499Type: GrantFiled: June 4, 2021Date of Patent: August 15, 2023Assignee: KMW INC.Inventors: Kyo Sung Ji, Chi Back Ryu, Min Soo Kim
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Patent number: D996402Type: GrantFiled: June 4, 2021Date of Patent: August 22, 2023Assignee: KMW INC.Inventors: Kyo Sung Ji, Chi Back Ryu, Min Soo Kim