Abstract: A method of fabricating an integrated circuit includes placing a first set of conductive feature patterns on a first level, placing a second set of conductive feature patterns on a second level, placing a first set of via patterns between the second set of conductive feature patterns and the first set of conductive feature patterns, placing a third set of conductive feature patterns on a third level different from the first level and the second level, placing a second set of via patterns between the third set of conductive feature patterns and the second set of conductive feature patterns, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.

Abstract: An assembly of multiple heat sink fins is comprised of multiple fins overlapped on one another and penetrated through by a heat conducting tube, each fin being provided at where close to the edge of the fin with a hole in a diameter slightly smaller than the outer diameter of the conducting tube to receive insertion of the conducting tube; an opening connected through the hole being formed on the edge of the fin; and the fin allowing the conducting tube being compressed into the hole through the opening as a clamp ring to secure the fin to the tube.

Abstract: A combination sink is comprised of multiple heat sinks made of sheet metal overlapped one another; each heat sink being provided with a base plate, a side wall being each provided to both longer sides of the base plate, one or more than one tab being adapted to the side wall, a slot being provided in the tab, a matching latch being provided on the base plate to be inserted through the slot in the base plate of another heat sink above.