Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.

Abstract: Double-injection molding methods through which the products do not have any parting lines between the molding materials comprise a mold, which has at least a male mold and a female mold. The male mold comprises at least one core. The female mold comprises at least one cavity and one core. The core of the male mold and the core of the female mold can be combined tightly. The male mold is stationary but the female mold is removable. The molding method of the present invention is to manufacture a product with two different plastic materials, where these two different plastic materials are injected into the mold in a specific order. And these two different plastic materials connect each other directly. After packing and cooling process, these two different plastic materials are shaped in the mold. A product with a smooth profile at the boundary of two materials is thus performed.