Abstract: A semiconductor device includes a logic circuit region having at least one core device and at least one input/output (I/O) device. The at least one core device has a first accumulative antenna ratio, and the at least one I/O device has a second accumulative antenna ratio. The first accumulative antenna ratio is greater than the second accumulative antenna ratio.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 ?m to 10 ?m. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.

Abstract: A dustproof gate valve includes a housing having a first panel, a second panel, and a valve port on each of the first and second panels, a slide including a body and a valve member and drivable to move between a first position and a second position, the slide closing the valve port of the first panel when at the first position, a driver mounted in the housing, a swing arm having one end thereof connected to the driver for moving the slide, and a dust pipe mounted in said body. When the slide is at the second position, the dust pipe is disposed between the valve port of the first panel and the valve port of the second panel, and the pipe wall of the dust pipe separates the valve ports of the first and second panels from the accommodation space.

Abstract: A dustproof gate valve includes a housing having a first panel, a second panel, and a valve port on each of the first and second panels, a slide including a body and a valve member and drivable to move between a first position and a second position, the slide closing the valve port of the first panel when at the first position, a driver mounted in the housing, a swing arm having one end thereof connected to the driver for moving the slide, and a dust pipe mounted in said body. When the slide is at the second position, the dust pipe is disposed between the valve port of the first panel and the valve port of the second panel, and the pipe wall of the dust pipe separates the valve ports of the first and second panels from the accommodation space.

Abstract: A right angle valve includes a valve body having a cavity, a first pipe and a second pipe connected therewith; a fixing member fixed to the valve body, having a combining end inserted into the cavity; a disc spring having one end combined to the combining end and the other end connected with a sealing member for sealing an inner end of the first pipe; a cover body fixed on one end of the valve body away from the first pipe; a piston member slidingly disposed in the cover body with one end thereof combined to the sealing member, and a covering measure. When the piston member drives the sealing member to move away from the inner end of the first pipe to enable the air flow, the covering measure covers the disc spring, preventing the disc spring from exposure to the flowing air, avoiding an obstruction.

Abstract: A method and apparatus for rinsing and drying a substrate (100) of a semiconductor wafer (102), has a first nozzle (110) dispensing rinsing fluid against the substrate (100); and a second nozzle (114) dispensing dry gas under pressure against the substrate (100) during a drying cycle to dry the substrate (100) completely. The second nozzle (114) can point to the substrate (100) while the substrate (100) spins. The nozzles (110) and (114) can be positioned by a robot arm (112).