Abstract: A waterproof speaker device includes a plate member, a speaker unit and a waterproof frame. The plate member includes an encircling block wall and a sound hole. The encircling block wall is provided on the plate member, and the sound hole passes through the plate member and is located within the encircling block wall. The encircling block wall is quadrilateral and includes four first positioning portions, and the first positioning portions are respectively located at four corners of the encircling block wall. The speaker unit is near the sound hole, and the encircling block wall surrounds the speaker unit. The waterproof frame is located between the encircling block wall and the speaker unit. The waterproof frame is quadrilateral and includes four second positioning portions, the second positioning portions are respectively located at four corners of the waterproof frame, and the first positioning portions respectively match the second positioning portions.

Abstract: A waterproof speaker device includes a plate member, a speaker unit and a waterproof frame. The plate member includes an encircling block wall and a sound hole. The encircling block wall is provided on the plate member, and the sound hole passes through the plate member and is located within the encircling block wall. The encircling block wall is quadrilateral and includes four first positioning portions, and the first positioning portions are respectively located at four corners of the encircling block wall. The speaker unit is near the sound hole, and the encircling block wall surrounds the speaker unit. The waterproof frame is located between the encircling block wall and the speaker unit. The waterproof frame is quadrilateral and includes four second positioning portions, the second positioning portions are respectively located at four corners of the waterproof frame, and the first positioning portions respectively match the second positioning portions.

Abstract: An electronic device having a buffering positioning mechanism includes a casing, an internal module and at least one buffer member. The casing includes two shells. Internal components of the electronic device are all provided on a carrier and are assembled to form the internal module. The internal module is accommodated in the casing, and is fixed to the casing without using any fixing elements. The buffer member fills and supports between an inner wall of the casing and an outer wall of the internal module, wherein the inner wall and the outer wall are opposite each other. Thus, collision resistance and fall resistance as well as an effect of fixing the internal module in the casing without using any fixing elements are achieved.

Abstract: A process system includes a manufacture device, a concentration detector and a compensation device. The manufacture device is used for processing a wafer using a chemical solution. The concentration detector detects a concentration of a key component in the chemical solution. The compensation device provides a supplement solution to the manufacture device when the concentration of the key component in the chemical solution is lower than a definite value, wherein the supplement solution includes a component that is the same as the key component in the chemical solution.