Abstract: The present disclosure provides a method for aligning a master oscillator power amplifier (MOPA) system. The method includes ramping up a pumping power input into a laser amplifier chain of the MOPA system until the pumping power input reaches an operational pumping power input level; adjusting a seed laser power output of a seed laser of the MOPA system until the seed laser power output is at a first level below an operational seed laser power output level; and performing a first optical alignment process to the MOPA system while the pumping power input is at the operational pumping power input level, the seed laser power output is at the first level, and the MOPA system reaches a steady operational thermal state.

Abstract: Improved inner spacers for semiconductor devices and methods of forming the same are disclosed.

Abstract: A method includes forming first and second semiconductor fins and a gate structure over a substrate; forming a first and second source/drain epitaxy structures over the first and second semiconductor fins; forming an interlayer dielectric (ILD) layer over the first and second source/drain epitaxy structures; etching the gate structure and the ILD layer to form a trench; performing a first surface treatment to modify surfaces of a top portion and a bottom portion of the trench to NH-terminated; performing a second surface treatment to modify the surfaces of the top portion of the trench to N-terminated, while leaving the surfaces of the bottom portion of the trench being NH-terminated; and depositing a first dielectric layer in the trench, wherein the first dielectric layer has a higher deposition rate on the surfaces of the bottom portion of the trench than on the surfaces of the bottom portion of the trench.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: A vacuum processing apparatus (110) for deposition of a material on a substrate is provided. The vacuum processing apparatus (110) includes a vacuum chamber comprising a processing area (111); a deposition apparatus (112) within the processing area (111) of the vacuum chamber; a cooling surface (113) inside the vacuum chamber; and one or more movable shields (220) between the cooling surface (113) and the processing area (111).

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a semiconductor protruding structure over a substrate and surrounding the semiconductor protruding structure with an insulating layer. The method also includes forming a dielectric layer over the insulating layer. The method further includes partially removing the dielectric layer and insulating layer using a planarization process. As a result, topmost surfaces of the semiconductor protruding structure, the insulating layer, and the dielectric layer are substantially level with each other. In addition, the method includes forming a protective layer to cover the topmost surfaces of the dielectric layer. The method includes recessing the insulating layer after the protective layer is formed such that the semiconductor protruding structure and a portion of the dielectric layer protrude from a top surface of a remaining portion of the insulating layer.

Abstract: The disclosure provides a limit device and a robot using the same. The limit device comprises a first connecting member, a transmission rod and a second connecting member. The first connecting member comprising a first main body portion and two first connecting elements. The two first connecting elements are arranged at intervals. The two first connecting elements are respectively connected to the first main body. The transmission rod comprising a first end and a second end. The first end and the second end are arranged at intervals. The first end penetrates through one of the two first connecting elements. The second end penetrates through the other one of the two first connecting element. The second connecting member provided with two indexing buckles. The two indexing buckles are arranged at intervals, each of the indexing buckles comprises a first limiting groove and a second limiting groove.

Abstract: A method of manufacturing a semiconductor device includes forming a multi-layer stack of alternating first layers of a first semiconductor material and second layers of a second semiconductor material on a semiconductor substrate, forming a first recess through the multi-layer stack, and laterally recessing sidewalls of the second layers of the multi-layer stack. The sidewalls are adjacent to the first recess. The method further includes forming inner spacers with respective seams adjacent to the recessed second layers of the multi-layer stack and performing an anneal treatment on the inner spacers to close the respective seams.

Abstract: Semiconductor devices and methods of manufacturing are presented in which inner spacers for nanostructures are manufactured. In embodiments a dielectric material is deposited for the inner spacer and then treated. The treatment may add material and cause an expansion in volume in order to close any seams that can interfere with subsequent processes.

Abstract: A cutting blade has two ends and two sides and includes a mounting hole mounted on a front housing of a brush cutter; a convex member on a central portion of either side and having two notches at two ends respectively and an intermediate, curved cutting edge; and two cutting edges on either side with the convex member disposed between, each cutting edge having a first end terminated at the notch and a second end terminated at either end. Two cutting edges of different sides with the mounting hole disposed between comprise a plurality of groups of an outward inclined cutting member and a cavity. The other two cutting edges of different sides with the mounting hole disposed between comprise a plurality of groups of an inward inclined cutting member and a recess.

Abstract: A cutting blade has two ends and two sides and includes a mounting hole mounted on a front housing of a brush cutter; a convex member on a central portion of either side and having two notches at two ends respectively and an intermediate, curved cutting edge; and two cutting edges on either side with the convex member disposed between, each cutting edge having a first end terminated at the notch and a second end terminated at either end. Two cutting edges of different sides with the mounting hole disposed between comprise a plurality of groups of an outward inclined cutting member and a cavity. The other two cutting edges of different sides with the mounting hole disposed between comprise a plurality of groups of an inward inclined cutting member and a recess.

Abstract: A rectangular blade of a string trimmer is provided. The rectangular blade includes two straight cutting edges, each straight cutting edge including a plurality of cuts which can be either V-shaped or U-shaped. In other embodiments, the blade has a shape different from the rectangle.

Abstract: An electrical treatment probe for caval sphincter includes: a head portion with a probe-head internal connecting tube connected to the rear of the head portion; a middle portion including a hollow middle-section tube with a first internal connecting tube and a second internal connecting tube disposed at the front and rear of the middle-section tube respectively; a tail portion including a hollow probe-tail tube with a probe-tail internal connecting tube disposed at the front of the probe-tail tube; two conductive rings sheathed on the probe-head internal connecting tube and the first internal connecting tube, and the second internal connecting tube and the probe-tail internal connecting tube respectively; a conductive wire module including first and second conductive wires which are pressed by the conductive rings to produce a contacting and positioning effect. Thus, an electrical treatment probe casing is formed by the aforementioned elements and filled with a filler.

Abstract: A video conference system built in an internet protocol (IP) network is provided. The system has: a multimedia capturing unit configured to photograph and output a first video signal; a DECT telephone configured to receive sounds and output a first audio signal; and a video conference terminal apparatus, including: an audio processing unit is an audio codec; a video processing unit is an video codec; and a network processing unit for transmitting a first network packet consisting of first audio/video streams generated by the audio/video processing units to the IP network, wherein the network processing unit receives a second network packet consisting of second audio/video streams from the IP network, wherein the second audio/video streams are decoded by the audio/video processing units, respectively, to generate second audio/video signals, which are displayed on the DECT telephone and a display apparatus, respectively.

Abstract: The bass drum pedal assembly includes a first connector, mounted on a shaft driven by a drum pedal; a second connector, engaging with the first connector, and coupled to a universal joint which links a connecting rod; and a positioning mechanism, comprising a central positioning member, an elastic member and a pin. The elastic member is put around the central positioning member to make the central positioning member elastically slidably disposed in a central hole of the first connector. The pin is inserted into a through hole at a lateral side of the first connector to press the central positioning member and the elastic member so that the central positioning member is elastically inserted in central holes of the first connector and the second connector.

Abstract: A video conference system built in an internet protocol (IP) network is provided. The system has: a multimedia capturing unit configured to photograph and output a first video signal; a DECT telephone configured to receive sounds and output a first audio signal; and a video conference terminal apparatus, including: an audio processing unit is an audio codec; a video processing unit is an video codec; and a network processing unit for transmitting a first network packet consisting of first audio/video streams generated by the audio/video processing units to the IP network, wherein the network processing unit receives a second network packet consisting of second audio/video streams from the IP network, wherein the second audio/video streams are decoded by the audio/video processing units, respectively, to generate second audio/video signals, which are displayed on the DECT telephone and a display apparatus, respectively.

Abstract: The bass drum pedal assembly includes a first connector, mounted on a shaft driven by a drum pedal; a second connector, engaging with the first connector, and coupled to a universal joint which links a connecting rod; and a positioning mechanism, comprising a central positioning member, an elastic member and a pin. The elastic member is put around the central positioning member to make the central positioning member elastically slidably disposed in a central hole of the first connector. The pin is inserted into a through hole at a lateral side of the first connector to press the central positioning member and the elastic member so that the central positioning member is elastically inserted in central holes of the first connector and the second connector.