Patents by Inventor Chi-Cheng Fu

Chi-Cheng Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11989066
    Abstract: In one or more embodiments, a fan circuit may be configured with an input of a first amplifier coupled to a revolution indicator associated with a fan; an output of the first amplifier coupled to an input of a second amplifier; and a power supply input of the second amplifier coupled to a first contact of a first connector. In one or more embodiments, the first contact of the first connector may be coupled to a first contact of a second connector to drive a resistive load coupled to the first contact of the second connector; a second contact of the first connector may be coupled to a second contact of the second connector to provide a reference voltage to the second amplifier; and the second amplifier may provide amplified signals to the first contact of the first connector based at least on signals received from the revolution indicator.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: May 21, 2024
    Assignee: Dell Products L.P.
    Inventors: Chi-Chang Fu, Feng Cheng Su, Chen Chi Hsieh
  • Publication number: 20240116090
    Abstract: Provided are a tank support jig and a tank cleaning method. The tank support jig for supporting a cylindrical tank includes a curved body having a first end and a second end that face with an interval in between; and a connecting member disposed across the interval, the connecting member connecting the first end and the second end of the curved body such that the interval is adjustable, in which the curved body and the connecting member form an annular structure for the tank that is to be placed horizontally inside the annular structure with the curved body in close contact with at least part of an outer circumferential face of the tank along a circumferential direction of the tank.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Inventors: Chun Cheng Chen, Chi Hsing Fu, Katsuyuki Ebisawa, Bo Yu Lin
  • Patent number: 11940737
    Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
  • Publication number: 20040142054
    Abstract: A blow molding mold assembly includes a first mold having a recess for receiving a dye permeable member therein. A second mold is located under the first mold and a mediate mold is clamped between the first mold and the second mold. A connection pipe assembly extends through the first mold and communicates with the dye permeable member so as to let dye attached on the material located on the mediate mold via the dye permeable member.
    Type: Application
    Filed: January 5, 2004
    Publication date: July 22, 2004
    Inventors: Hsizh Jui Feng, Chi-Cheng Fu, Hsiao-Chien Min
  • Publication number: 20030161905
    Abstract: A blow molding mold assembly includes a first mold having a recess for receiving a dye permeable member therein. A second mold is overlapped on the first mold and a mediate mold is clamped between the first mold and the second mold. A connection pipe assembly extends through the first mold and communicates with the dye permeable member so as to let dye attached on the material located on the mediate mold via the dye permeable member.
    Type: Application
    Filed: March 21, 2001
    Publication date: August 28, 2003
    Inventors: Jui-Peng Hsieh, Chi-Cheng Fu, Chien Min Hsiao