Patents by Inventor Chi-Ching Ho
Chi-Ching Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128249Abstract: An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.Type: ApplicationFiled: December 8, 2022Publication date: April 18, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chi-Ching HO
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Patent number: 11923337Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.Type: GrantFiled: August 29, 2019Date of Patent: March 5, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
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Publication number: 20240038685Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.Type: ApplicationFiled: September 22, 2022Publication date: February 1, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Fang-Lin Tsai
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Publication number: 20230420420Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.Type: ApplicationFiled: September 11, 2023Publication date: December 28, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Ching HO, Bo-Hao MA, Yu-Ting XUE, Ching-Hung TSENG, Guan-Hua LU, Hong-Da CHANG
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Publication number: 20230282586Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.Type: ApplicationFiled: May 10, 2022Publication date: September 7, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Shuai-Lin Liu
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Publication number: 20230253331Abstract: An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.Type: ApplicationFiled: August 29, 2022Publication date: August 10, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yi-Min Fu, Chi-Ching Ho, Chao-Chiang Pu, Yu-Po Wang
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Publication number: 20230154865Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.Type: ApplicationFiled: January 10, 2022Publication date: May 18, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Po-Yuan Su
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Publication number: 20230111192Abstract: Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.Type: ApplicationFiled: November 16, 2021Publication date: April 13, 2023Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yi-Min Fu, Chi-Ching Ho, Cheng-Yu Kang, Yu-Po Wang
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Publication number: 20220399246Abstract: An electronic package is provided, where a laterally diffused metal oxide semiconductor (LDMOS) type electronic structure is mounted onto a complementary metal oxide semiconductor (CMOS) type electronic element to be integrated into a chip module, thereby shortening electrical transmission path between the electronic structure and the electronic element so as to reduce the communication time between the electronic structure and the electronic element.Type: ApplicationFiled: June 1, 2022Publication date: December 15, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yi-Min Fu, Chi-Ching Ho, Yu-Po Wang
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Publication number: 20220130769Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.Type: ApplicationFiled: December 15, 2020Publication date: April 28, 2022Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Ching HO, Bo-Hao MA, Chee-Key CHUNG
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Patent number: 11315881Abstract: An electronic package is provided, in which at least one first electronic component is arranged on one surface of a circuit structure with circuit layers and a plurality of second electronic components are arranged on the other surface. The first electronic component can electrically bridge two of the plurality of second electronic components via the circuit layers to replace part of the circuit layers of the circuit structure, so that the circuit layers of the circuit structure can maintain a larger wiring specification and reduce the number of circuit layers, thereby improving the process yield.Type: GrantFiled: December 15, 2020Date of Patent: April 26, 2022Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chi-Ching Ho, Bo-Hao Ma, Chee-Key Chung
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Publication number: 20200350285Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.Type: ApplicationFiled: August 29, 2019Publication date: November 5, 2020Inventors: Chi-Ching Ho, Bo-Hao Ma, Yu-Ting Xue, Ching-Hung Tseng, Guan-Hua Lu, Hong-Da Chang
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Publication number: 20190043819Abstract: An electronic package is provided, including an electronic component, a redistribution structure formed on the electronic component, a plurality of conductive posts bonded to the redistribution structure, and a redistribution layer bonded to the conductive posts. As such, the electronic component that meets the requirement of miniaturization can be electrically connected to an electronic device through the redistribution structure, the conductive posts and the redistribution layer.Type: ApplicationFiled: January 12, 2018Publication date: February 7, 2019Inventors: Chi-Ching Ho, Ying-Chou Tsai
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Patent number: 9991197Abstract: A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods.Type: GrantFiled: June 26, 2017Date of Patent: June 5, 2018Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chia-Cheng Chen, Chi-Ching Ho, Shao-Tzu Tang, Yu-Che Liu, Ying-Chou Tsai
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Patent number: 9899235Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.Type: GrantFiled: October 14, 2016Date of Patent: February 20, 2018Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chi-Ching Ho, Ying-Chou Tsai, Sheng-Che Huang
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Publication number: 20170294372Abstract: A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric layer to encapsulate the semiconductor chip and the conductive trace layer. Since a strong bonding is formed between the dielectric layer and the conductive trace layer, the present invention can prevent delamination between the dielectric layer and the conductive trace layer from occurrence, thereby improving reliability and facilitating the package miniaturization by current fabrication methods.Type: ApplicationFiled: June 26, 2017Publication date: October 12, 2017Inventors: Chia-Cheng Chen, Chi-Ching Ho, Shao-Tzu Tang, Yu-Che Liu, Ying-Chou Tsai
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Publication number: 20170047230Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.Type: ApplicationFiled: October 14, 2016Publication date: February 16, 2017Inventors: Chi-Ching Ho, Ying-Chou Tsai, Sheng-Che Huang
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Publication number: 20170033037Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.Type: ApplicationFiled: October 14, 2016Publication date: February 2, 2017Inventors: Chi-Ching Ho, Ying-Chou Tsai, Sheng-Che Huang
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Patent number: 9265154Abstract: A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density.Type: GrantFiled: August 18, 2014Date of Patent: February 16, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Shao-Tzu Tang, Chi-Ching Ho, Ying-Chou Tsai
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Publication number: 20150305162Abstract: A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density.Type: ApplicationFiled: August 18, 2014Publication date: October 22, 2015Inventors: Shao-tzu Tang, Chi-Ching Ho, Ying-Chou Tsai