Abstract: A multi-specification plug adapter, the multi-specification plug adapter comprises a first outer casing and a second outer casing assembled with each other. The second outer casing is provided with one or more than one socket hole; one or more than one slideable plug is located in the first outer casing. The plug is provided with a push button. The push button is located outside the first outer casing. The first plug pins or the second plug pins of the plug can be extended out of the first outer casing by pushing the push button. One set of or more than one set of corresponding shaft and shaft hole is located between the second outer casing and the first outer casing, the first outer casing can rotate against the second outer casing on the shaft.

Abstract: A multi-specification plug adapter, the multi-specification plug adapter comprises a first outer casing and a second outer casing assembled with each other. The second outer casing is provided with one or more than one socket hole; one or more than one slideable plug is located in the first outer casing. The plug is provided with a push button. The push button is located outside the first outer casing. The first plug pins or the second plug pins of the plug can be extended out of the first outer casing by pushing the push button. One set of or more than one set of corresponding shaft and shaft hole is located between the second outer casing and the first outer casing, the first outer casing can rotate against the second outer casing on the shaft.

Abstract: A semiconductor package comprises a first chip, a substrate, a middle layer, a second chip, and an encapsulant. The first chip has an active surface and a high-frequency element defining a high-frequency area on the active surface. The substrate supports the first chip and is electrically connected to the first chip. The middle layer is disposed on the first chip and has a recess corresponding to the high-frequency area. The second chip is disposed on the middle layer and electrically connected to either the first chip or the substrate. The encapsulant encapsulates the first chip, the middle layer, the second chip, and a part of the substrate.

Abstract: A light emitting device includes an LED package bases, an LED chip disposed on the LED package base, and a lens disposed on the LED package base. The lens includes a frustum shape having an inclined outer peripheral surface, and having a relatively smaller lower portion for attaching onto the LED package base, and having a relatively greater upper portion spaced away from the LED package base, the lens includes a longitudinal axis arranged to have an included angle ? formed between the longitudinal axis and the inclined outer peripheral surface of the lens, for reflecting light sidewise. The lens may include a curved recess formed in the upper portion for such as light diffusing purposes.

Abstract: There is provided a method for accessing at least one digital file from a collection comprising more than one digital file in an electronic device, including: generating one index comprising of information entries obtained from each of the more than one digital file in the collection, with each digital file in the collection information being linked to at least one information entry; receiving a speaker independent speech input in at least one language during a speech reception mode; determining a language of the speech input; and setting the speech reception mode to the language of the speech input; comparing the speech input received during the speech reception mode with the entries in the index. The file may advantageously be accessed when the speech input coincides with at least one of the information entries in the index. The digital files may be stored in the electronic device, any device functionally connected to the electronic device or a combination of the aforementioned.

Abstract: A semiconductor package comprises a first chip, a substrate, a middle layer, a second chip, and an encapsulant. The first chip has an active surface and a high-frequency element defining a high-frequency area on the active surface. The substrate supports the first chip and is electrically connected to the first chip. The middle layer is disposed on the first chip and has a recess corresponding to the high-frequency area. The second chip is disposed on the middle layer and electrically connected to either the first chip or the substrate. The encapsulant encapsulates the first chip, the middle layer, the second chip, and a part of the substrate.

Abstract: An impedance standard substrate for calibrating a vector network analyzer comprises a first surface and a second surface opposite to the first surface. A thru-circuit has two contacts electrically connected to each other. The two contacts are disposed on the first surface and the second surface, respectively. The impedance standard substrate further comprises a pair of open-circuits, a pair of short-circuits, and a pair of load-circuits disposed on the first surface and the second surface, respectively.