Abstract: A packet forwarding network may include spine and leaf switches that forward network traffic between end hosts. The packet forwarding network may be implemented on multiple network racks in a rack-based system. A controller may control the underlying spine and leaf switches to form on-premise virtual private cloud (VPC) resources. In particular, the controller may form enterprise VPC (EVPC) tenants, each having a virtual router that performs routing between different segments within the corresponding EVPC tenant. The different segments may separately include web, application, and database servers, as end hosts. The controller may form a system VPC tenant having a virtual system router that performs routing between different EVPC tenants. A segment in an internal VPC tenant formed by the controller and/or an external VPC tenant formed by the controller may provide external network access for one or more of the EVPC tenants.

Abstract: A packet forwarding network may include spine and leaf switches that forward network traffic between end hosts. The packet forwarding network may be implemented on multiple network racks in a rack-based system. A controller may control the underlying spine and leaf switches to form on-premise virtual private cloud (VPC) resources. In particular, the controller may form enterprise VPC (EVPC) tenants, each having a virtual router that performs routing between different segments within the corresponding EVPC tenant. The different segments may separately include web, application, and database servers, as end hosts. The controller may form a system VPC tenant having a virtual system router that performs routing between different EVPC tenants. A segment in an internal VPC tenant formed by the controller and/or an external VPC tenant formed by the controller may provide external network access for one or more of the EVPC tenants.

Abstract: A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.

Abstract: A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the first axis that is larger than the width of the capillary. In particular, the mounting hole is configured such that application of a flexion force to reduce the second width simultaneously expands the first width so as to fit the capillary when the first width is larger than the width of the capillary, and removal of said flexion force contracts the first width whereby to grip the capillary using an elastic force of the horn.

Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.

Abstract: The invention provides an apparatus and method for indexing a length of film for severance. The apparatus comprises a linear feeding device operative to hold the film and to feed a predetermined amount of film to a trimming device by moving linearly between an initial position and another position towards the trimming device. A film holder located between the linear feeding device and the trimming device is operable between a first position wherein a gap is provided for the film to pass through during feeding to the trimming device, and a second position for clamping the film when severing the film with the trimming device.