Patents by Inventor Chi-Chuan Wang
Chi-Chuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240082640Abstract: An exercise intensity assessing system includes a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser exercises. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database for being diagnosed and analyzed by a fitness instructor. The cloud database obtains a forecasted watt value corresponding to the physiological information, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.Type: ApplicationFiled: October 18, 2022Publication date: March 14, 2024Applicant: EHUNTSUN HEALTH TECHNOLOGY CO., LTD.Inventors: Chao-Chuan CHEN, Han-Pin HO, Jong-Shyan WANG, Yu-Ting LIN, Chi-Yao CHIANG, Yu-Liang LIN
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Publication number: 20240082642Abstract: An intelligent exercise intensity assessing system includes an exercise testing machine, a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser operates the exercise testing machine. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database. The cloud database analyzes the physiological information to obtain a corresponding forecasted watt value, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.Type: ApplicationFiled: October 18, 2022Publication date: March 14, 2024Applicant: EHUNTSUN HEALTH TECHNOLOGY CO., LTD.Inventors: Chao-Chuan CHEN, Han-Pin HO, Jong-Shyan WANG, Yu-Ting LIN, Chi-Yao CHIANG, Yu-Liang LIN
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Patent number: 11924995Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.Type: GrantFiled: April 23, 2021Date of Patent: March 5, 2024Inventors: Chi-Chuan Wang, Cheng-Chen Cheng, Chuan-Chan Huang, Jen-Chieh Huang
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Publication number: 20230272980Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: May 5, 2023Publication date: August 31, 2023Applicant: COOLER MASTER CO., LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
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Patent number: 11686532Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: GrantFiled: December 4, 2020Date of Patent: June 27, 2023Assignee: COOLER MASTER CO., LTD.Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
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Publication number: 20220346269Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.Type: ApplicationFiled: April 23, 2021Publication date: October 27, 2022Inventors: Chi-Chuan WANG, Cheng-Chen CHENG, Chuan-Chan HUANG, Jen-Chieh HUANG
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Patent number: 11293459Abstract: A fan device including high voltage power source, conductive blade, first electrode and a resistance device is provided. Connecting side of the conductive blade is connected to first electric contact of the high voltage power source, and the conductive blade further includes a vibration side, wherein the conductive blade is extended from the connecting side to the vibration side along a first direction. The first electrode electrically connected to the second electric contact of the high voltage power source. The first electrode is disposed on a side of the vibration side of the conductive blade, and located in the vibrating range of the vibration side. The resistance device is connected between the conductive blade and the second electric contact in series.Type: GrantFiled: August 6, 2019Date of Patent: April 5, 2022Assignee: NATIONAL CHIAO TUNG UNIVERSITYInventors: Yeng-Yung Tsui, Chi-Chuan Wang, Ting-Kai Wei, Hsueh-Han Chin
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Patent number: 11287303Abstract: The present invention relates to a flow rate measuring method comprising: establishing a database which includes a plurality of flow profiles; measuring the flow in a flow field using a plurality of transducers wherein in between every two transducers there exists an acoustic path which indicates the flow speed of the flow between the two transducers, and a feature map can be derived from the flow speeds; comparing the feature map with the database; selecting a matching flow profile from the flow profiles wherein the matching flow profile has a plurality of weighting functions corresponding to the acoustic paths; and calibrating the flow speed using the weighting functions.Type: GrantFiled: April 21, 2020Date of Patent: March 29, 2022Assignee: NATIONAL CHIAO TUNG UNIVERSITYInventors: Chi-Chuan Wang, Tran Ngoc Tan
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Publication number: 20210325233Abstract: The present invention relates to a flow rate measuring method comprising: establishing a database which includes a plurality of flow profiles; measuring the flow in a flow field using a plurality of transducers wherein in between every two transducers there exists an acoustic path which indicates the flow speed of the flow between the two transducers, and a feature map can be derived from the flow speeds; comparing the feature map with the database; selecting a matching flow profile from the flow profiles wherein the matching flow profile has a plurality of weighting functions corresponding to the acoustic paths; and calibrating the flow speed using the weighting functions.Type: ApplicationFiled: April 21, 2020Publication date: October 21, 2021Applicant: NATIONAL CHIAO TUNG UNIVERSITYInventors: Chi-Chuan Wang, Tran Ngoc Tan
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Patent number: 10976116Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.Type: GrantFiled: March 27, 2019Date of Patent: April 13, 2021Assignee: Coretronic CorporationInventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin, Chi-Chuan Wang, Yong-Dong Zhang
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Publication number: 20210088288Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: December 4, 2020Publication date: March 25, 2021Applicant: COOLER MASTER CO., LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
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Patent number: 10907907Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: GrantFiled: March 14, 2018Date of Patent: February 2, 2021Assignee: COOLER MASTER CO., LTD.Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
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Patent number: 10883741Abstract: A dehumidification device with enhanced dehumidification effect includes a gas cooler receiving a first air gas and condensing the first air gas into a first condensing gas and a first condensing liquid. A heat exchanger has an inlet and an outlet. The first condensing gas flows from the gas cooler to a periphery of the heat exchanger to cool the heat exchanger. The inlet receives a second air gas from outside. The second air gas is condensed into a second condensing gas and a second condensing liquid using the cooled heat exchanger, and the second condensing gas and the second condensing liquid are expelled from the outlet. A gas heater receives the first condensing gas flowing through the periphery of the heat exchanger and the second condensing gas expelled from the outlet, and heats and turns them into dry air, and the gas heater expels the dry air.Type: GrantFiled: March 15, 2018Date of Patent: January 5, 2021Assignee: National Chiao Tung UnviersityInventors: Chi-Chuan Wang, Chuang-Hui Chiu
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Publication number: 20200047190Abstract: A fan device including high voltage power source, conductive blade, first electrode and a resistance device is provided. Connecting side of the conductive blade is connected to first electric contact of the high voltage power source, and the conductive blade further includes a vibration side, wherein the conductive blade is extended from the connecting side to the vibration side along a first direction. The first electrode electrically connected to the second electric contact of the high voltage power source. The first electrode is disposed on a side of the vibration side of the conductive blade, and located in the vibrating range of the vibration side. The resistance device is connected between the conductive blade and the second electric contact in series.Type: ApplicationFiled: August 6, 2019Publication date: February 13, 2020Applicant: NATIONAL CHIAO TUNG UNIVERSITYInventors: Yeng-Yung Tsui, Chi-Chuan Wang, Ting-Kai Wei, Hsueh-Han Chin
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Publication number: 20190360764Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.Type: ApplicationFiled: March 27, 2019Publication date: November 28, 2019Applicant: Coretronic CorporationInventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin, Chi-Chuan Wang, Yong-Dong Zhang
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Publication number: 20190195567Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: March 14, 2018Publication date: June 27, 2019Applicant: COOLER MASTER CO.,LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
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Patent number: 10281807Abstract: A projector includes a casing, an optical engine module, and a heat dissipation module. The optical engine module is disposed in the casing. The heat dissipation module is disposed in the casing and includes a heat dissipation fin set. The heat dissipation fin set includes at least one heat dissipation fin and at least one turbulent structure. The heat dissipation fin has a surface. The surface includes a first turbulent region and a second turbulent region. The first turbulent region is adjacent to the second turbulent region. The turbulent structure is disposed at least one of the first turbulent region and the second turbulent region, and the turbulent structure protrudes from the surface. An opening is formed between a top end of the turbulent structure and the surface.Type: GrantFiled: January 12, 2018Date of Patent: May 7, 2019Assignee: Coretronic CorporationInventors: Chi-Chuan Wang, Yung-Ming Li, Tsung-Ching Lin, Jhih-Hao Chen, Wei-Chi Liu, Shi-Wen Lin
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Patent number: 10114274Abstract: A heat dissipation module includes a heat dissipation fin set. The heat dissipation fin set includes a plurality of heat dissipation fins, wherein these heat dissipation fins are stacked on each other, and each of the heat dissipation fins has a front side, a rear side opposite to the front side and at least one turbulent structure set. The turbulent structure set is located between the front side and the rear side and includes a plurality of first turbulent structures. The first turbulent structures are arranged from the front side to the rear side in sequence. A heat dissipation airflow flows from the front side toward the turbulent structure set along a flowing direction, and passes through the turbulent structure set to flow toward the rear side. An extending direction of each of the first turbulent structures is tilted relative to the flowing direction.Type: GrantFiled: June 29, 2015Date of Patent: October 30, 2018Assignee: Coretronic CorporationInventors: Chi-Chuan Wang, Po-Sheng Huang, Shang-Hsuang Wu, Tsung-Ching Lin, Wen-Yen Chung, Jhih-Hao Chen
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Patent number: 10082349Abstract: A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface.Type: GrantFiled: January 6, 2016Date of Patent: September 25, 2018Assignee: NATIONAL CHIAO TUNG UNIVERSITYInventors: Chi-Chuan Wang, Kuo-Wei Lin
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Publication number: 20180266724Abstract: A dehumidification device with enhanced dehumidification effect includes a gas cooler receiving a first air gas and condensing the first air gas into a first condensing gas and a first condensing liquid. A heat exchanger has an inlet and an outlet. The first condensing gas flows from the gas cooler to a periphery of the heat exchanger to cool the heat exchanger. The inlet receives a second air gas from outside. The second air gas is condensed into a second condensing gas and a second condensing liquid using the cooled heat exchanger, and the second condensing gas and the second condensing liquid are expelled from the outlet. A gas heater receives the first condensing gas flowing through the periphery of the heat exchanger and the second condensing gas expelled from the outlet, and heats and turns them into dry air, and the gas heater expels the dry air.Type: ApplicationFiled: March 15, 2018Publication date: September 20, 2018Inventors: CHI-CHUAN WANG, CHUANG-HUI CHIU