Patents by Inventor Chi-Chuan Wang

Chi-Chuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240082640
    Abstract: An exercise intensity assessing system includes a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser exercises. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database for being diagnosed and analyzed by a fitness instructor. The cloud database obtains a forecasted watt value corresponding to the physiological information, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 14, 2024
    Applicant: EHUNTSUN HEALTH TECHNOLOGY CO., LTD.
    Inventors: Chao-Chuan CHEN, Han-Pin HO, Jong-Shyan WANG, Yu-Ting LIN, Chi-Yao CHIANG, Yu-Liang LIN
  • Publication number: 20240082642
    Abstract: An intelligent exercise intensity assessing system includes an exercise testing machine, a physiological information sensor, a signal transmitter connected with the physiological information sensor, a central control host connected with the signal transmitter, and a cloud database connected with the central control host. The physiological information sensor senses physiological information of an exerciser before and after the exerciser operates the exercise testing machine. The physiological information is transmitted by the signal transmitter to the central control host, and transmitted by the central control host to the cloud database. The cloud database analyzes the physiological information to obtain a corresponding forecasted watt value, and obtains a resistance level of different fitness apparatuses according to the forecasted watt value.
    Type: Application
    Filed: October 18, 2022
    Publication date: March 14, 2024
    Applicant: EHUNTSUN HEALTH TECHNOLOGY CO., LTD.
    Inventors: Chao-Chuan CHEN, Han-Pin HO, Jong-Shyan WANG, Yu-Ting LIN, Chi-Yao CHIANG, Yu-Liang LIN
  • Patent number: 11924995
    Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 5, 2024
    Inventors: Chi-Chuan Wang, Cheng-Chen Cheng, Chuan-Chan Huang, Jen-Chieh Huang
  • Publication number: 20230272980
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Application
    Filed: May 5, 2023
    Publication date: August 31, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
  • Patent number: 11686532
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: June 27, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
  • Publication number: 20220346269
    Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.
    Type: Application
    Filed: April 23, 2021
    Publication date: October 27, 2022
    Inventors: Chi-Chuan WANG, Cheng-Chen CHENG, Chuan-Chan HUANG, Jen-Chieh HUANG
  • Patent number: 11293459
    Abstract: A fan device including high voltage power source, conductive blade, first electrode and a resistance device is provided. Connecting side of the conductive blade is connected to first electric contact of the high voltage power source, and the conductive blade further includes a vibration side, wherein the conductive blade is extended from the connecting side to the vibration side along a first direction. The first electrode electrically connected to the second electric contact of the high voltage power source. The first electrode is disposed on a side of the vibration side of the conductive blade, and located in the vibrating range of the vibration side. The resistance device is connected between the conductive blade and the second electric contact in series.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 5, 2022
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Yeng-Yung Tsui, Chi-Chuan Wang, Ting-Kai Wei, Hsueh-Han Chin
  • Patent number: 11287303
    Abstract: The present invention relates to a flow rate measuring method comprising: establishing a database which includes a plurality of flow profiles; measuring the flow in a flow field using a plurality of transducers wherein in between every two transducers there exists an acoustic path which indicates the flow speed of the flow between the two transducers, and a feature map can be derived from the flow speeds; comparing the feature map with the database; selecting a matching flow profile from the flow profiles wherein the matching flow profile has a plurality of weighting functions corresponding to the acoustic paths; and calibrating the flow speed using the weighting functions.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: March 29, 2022
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chi-Chuan Wang, Tran Ngoc Tan
  • Publication number: 20210325233
    Abstract: The present invention relates to a flow rate measuring method comprising: establishing a database which includes a plurality of flow profiles; measuring the flow in a flow field using a plurality of transducers wherein in between every two transducers there exists an acoustic path which indicates the flow speed of the flow between the two transducers, and a feature map can be derived from the flow speeds; comparing the feature map with the database; selecting a matching flow profile from the flow profiles wherein the matching flow profile has a plurality of weighting functions corresponding to the acoustic paths; and calibrating the flow speed using the weighting functions.
    Type: Application
    Filed: April 21, 2020
    Publication date: October 21, 2021
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chi-Chuan Wang, Tran Ngoc Tan
  • Patent number: 10976116
    Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: April 13, 2021
    Assignee: Coretronic Corporation
    Inventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin, Chi-Chuan Wang, Yong-Dong Zhang
  • Publication number: 20210088288
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Application
    Filed: December 4, 2020
    Publication date: March 25, 2021
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
  • Patent number: 10907907
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: February 2, 2021
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chi-Chuan Wang, Chang-Yu Hsieh, Shan-Yin Cheng, Hsiang-Fen Chou
  • Patent number: 10883741
    Abstract: A dehumidification device with enhanced dehumidification effect includes a gas cooler receiving a first air gas and condensing the first air gas into a first condensing gas and a first condensing liquid. A heat exchanger has an inlet and an outlet. The first condensing gas flows from the gas cooler to a periphery of the heat exchanger to cool the heat exchanger. The inlet receives a second air gas from outside. The second air gas is condensed into a second condensing gas and a second condensing liquid using the cooled heat exchanger, and the second condensing gas and the second condensing liquid are expelled from the outlet. A gas heater receives the first condensing gas flowing through the periphery of the heat exchanger and the second condensing gas expelled from the outlet, and heats and turns them into dry air, and the gas heater expels the dry air.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: January 5, 2021
    Assignee: National Chiao Tung Unviersity
    Inventors: Chi-Chuan Wang, Chuang-Hui Chiu
  • Publication number: 20200047190
    Abstract: A fan device including high voltage power source, conductive blade, first electrode and a resistance device is provided. Connecting side of the conductive blade is connected to first electric contact of the high voltage power source, and the conductive blade further includes a vibration side, wherein the conductive blade is extended from the connecting side to the vibration side along a first direction. The first electrode electrically connected to the second electric contact of the high voltage power source. The first electrode is disposed on a side of the vibration side of the conductive blade, and located in the vibrating range of the vibration side. The resistance device is connected between the conductive blade and the second electric contact in series.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Yeng-Yung Tsui, Chi-Chuan Wang, Ting-Kai Wei, Hsueh-Han Chin
  • Publication number: 20190360764
    Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.
    Type: Application
    Filed: March 27, 2019
    Publication date: November 28, 2019
    Applicant: Coretronic Corporation
    Inventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin, Chi-Chuan Wang, Yong-Dong Zhang
  • Publication number: 20190195567
    Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
    Type: Application
    Filed: March 14, 2018
    Publication date: June 27, 2019
    Applicant: COOLER MASTER CO.,LTD.
    Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU
  • Patent number: 10281807
    Abstract: A projector includes a casing, an optical engine module, and a heat dissipation module. The optical engine module is disposed in the casing. The heat dissipation module is disposed in the casing and includes a heat dissipation fin set. The heat dissipation fin set includes at least one heat dissipation fin and at least one turbulent structure. The heat dissipation fin has a surface. The surface includes a first turbulent region and a second turbulent region. The first turbulent region is adjacent to the second turbulent region. The turbulent structure is disposed at least one of the first turbulent region and the second turbulent region, and the turbulent structure protrudes from the surface. An opening is formed between a top end of the turbulent structure and the surface.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: May 7, 2019
    Assignee: Coretronic Corporation
    Inventors: Chi-Chuan Wang, Yung-Ming Li, Tsung-Ching Lin, Jhih-Hao Chen, Wei-Chi Liu, Shi-Wen Lin
  • Patent number: 10114274
    Abstract: A heat dissipation module includes a heat dissipation fin set. The heat dissipation fin set includes a plurality of heat dissipation fins, wherein these heat dissipation fins are stacked on each other, and each of the heat dissipation fins has a front side, a rear side opposite to the front side and at least one turbulent structure set. The turbulent structure set is located between the front side and the rear side and includes a plurality of first turbulent structures. The first turbulent structures are arranged from the front side to the rear side in sequence. A heat dissipation airflow flows from the front side toward the turbulent structure set along a flowing direction, and passes through the turbulent structure set to flow toward the rear side. An extending direction of each of the first turbulent structures is tilted relative to the flowing direction.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: October 30, 2018
    Assignee: Coretronic Corporation
    Inventors: Chi-Chuan Wang, Po-Sheng Huang, Shang-Hsuang Wu, Tsung-Ching Lin, Wen-Yen Chung, Jhih-Hao Chen
  • Patent number: 10082349
    Abstract: A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: September 25, 2018
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chi-Chuan Wang, Kuo-Wei Lin
  • Publication number: 20180266724
    Abstract: A dehumidification device with enhanced dehumidification effect includes a gas cooler receiving a first air gas and condensing the first air gas into a first condensing gas and a first condensing liquid. A heat exchanger has an inlet and an outlet. The first condensing gas flows from the gas cooler to a periphery of the heat exchanger to cool the heat exchanger. The inlet receives a second air gas from outside. The second air gas is condensed into a second condensing gas and a second condensing liquid using the cooled heat exchanger, and the second condensing gas and the second condensing liquid are expelled from the outlet. A gas heater receives the first condensing gas flowing through the periphery of the heat exchanger and the second condensing gas expelled from the outlet, and heats and turns them into dry air, and the gas heater expels the dry air.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 20, 2018
    Inventors: CHI-CHUAN WANG, CHUANG-HUI CHIU