Patents by Inventor Chi Chuen Chaw

Chi Chuen Chaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip bonding tool
    Patent number: 7458495
    Abstract: A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: December 2, 2008
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Ran Fu, Deming Liu, Chi Chuen Chaw, Hing Leung Li, Chak Hau Pang, Hing Suen Siu
  • Coating for enhancing adhesion of molding compound to semiconductor devices
    Patent number: 7329617
    Abstract: A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: February 12, 2008
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Jianxiong Li, Chi Chuen Chaw, Ngai Kin Tsui, Deming Liu, Yiu Fai Kwan, Wai Chan