Patents by Inventor Chi Chung Mok

Chi Chung Mok has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wedge bonding head
    Patent number: 6513696
    Abstract: The present invention provides a bonding head for a wedge wire bonding apparatus in which the bonding force of the transducer assembly, and also the clamping force of the wire clamping assembly are provided by permanent magnet motors including a coil formed as part of the transducer assembly and the wire clamping assembly respectively and with the coils located between magnets fixed to a bond head bracket member. The use of permanent magnet motors to provide the bonding and clamping forces results in apparatus in which the bonding and clamping forces can be controlled with high accuracy and reliability.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: February 4, 2003
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Wing Cheung Ho, Gary Peter Widdowson, Chun Ho Ho, Chi Chung Mok, Siu Yan Ho