Patents by Inventor Chi Dang Thi Thuy

Chi Dang Thi Thuy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for Wafer Bonding
    Publication number: 20240112944
    Abstract: The present disclosure relates to a temporary wafer bonding process including the steps of: providing a wafer for back processing by laminating a plain protective film on a front surface of the wafer; providing a rigid carrier; bonding the rigid carrier to the plain protective film by the intermediate of a bonding material layer; processing a back surface of the wafer; and separating the rigid carrier and the plain protective film from the wafer.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 4, 2024
    Inventors: Jakob Visker, Lan Peng, Serge Vanhaelemeersch, Aurelie Humbert, Chi Dang Thi Thuy, Evert Visker