Abstract: A silicon controlled rectifier (SCR) includes a first p-well region, a second p-well region, and an n-doped region. The first p-well region is coupled to a first trigger terminal via a first p-doped tap region disposed in the first p-well region. The first p-doped tap region has a higher concentration of a p-type dopant than the first p-well region. The second p-well region is coupled to a second trigger terminal via a second p-doped tap region disposed in the second p-well region. The second p-doped tap region has a higher concentration of a p-type dopant than the second p-well region.

Abstract: A field effect transistor, FET, is proposed. The FET includes a source region of a first conductivity type that is electrically connected to a source electrode at a first surface of a semiconductor body. The FET further includes a drain region of the first conductivity type that is electrically connected to a drain electrode at the first surface. A dielectric structure is arranged between the source region and the drain region along a first lateral direction. The dielectric structure includes a gate dielectric on the first surface and a field dielectric structure having a bottom side below the first surface. The FET further includes a gate electrode on the gate dielectric. The gate electrode and the field dielectric structure are spaced from each other along the first lateral direction. The FET further includes a field electrode having a bottom side below a top side of the field dielectric structure.

Abstract: The present invention relates to a method for perceiving an event tagging-based situation and a system for same which recognize a plurality of objects by using camera images and apply technology for tracking the movements of the plurality of recognized objects to enable the perception of various situations.

Abstract: A semiconductor device includes a body region of a second conductivity type, a body contact region of the second conductivity type formed in the body region and having a higher average doping concentration than the body region, a source region of a first conductivity type opposite the second conductivity type formed in the body region adjacent the body contact region, a drift zone of the first conductivity type spaced apart from the source region by a section of the body region which forms a channel region of the semiconductor device, and a gate electrode configured to control the channel region. The body contact region extends under a majority of the source region in a direction towards the channel region and has a doping concentration of at least 1e18 cm?3 under the majority of the source region. Additional semiconductor device embodiments and methods of manufacture are described.

Abstract: A semiconductor device includes a body region of a second conductivity type, a body contact region of the second conductivity type formed in the body region and having a higher average doping concentration than the body region, a source region of a first conductivity type opposite the second conductivity type formed in the body region adjacent the body contact region, a drift zone of the first conductivity type spaced apart from the source region by a section of the body region which forms a channel region of the semiconductor device, and a gate electrode configured to control the channel region. The body contact region extends under a majority of the source region in a direction towards the channel region and has a doping concentration of at least 1e18 cm?3 under the majority of the source region, Additional semiconductor device embodiments and methods of manufacture are described.

Abstract: A semiconductor device has an active region that includes a semiconductor layer. A transistor is formed in and above the active region, wherein the transistor has an implanted halo region that includes a halo dopant species and defines a halo dopant profile in the semiconductor layer. An implanted carbon species is positioned in the semiconductor layer, wherein the implanted carbon species defines a carbon species profile in the semiconductor layer that is substantially the same as the halo dopant profile of the implanted halo region in the semiconductor layer.

Abstract: A semiconductor device has an active region that includes a semiconductor layer. A transistor is formed in and above the active region, wherein the transistor has an implanted halo region that includes a halo dopant species and defines a halo dopant profile in the semiconductor layer. An implanted carbon species is positioned in the semiconductor layer, wherein the implanted carbon species defines a carbon species profile in the semiconductor layer that is substantially the same as the halo dopant profile of the implanted halo region in the semiconductor layer.

Abstract: A method of forming a semiconductor device is provided including co-implanting a halo species and carbon in a semiconductor layer with a finite tilt angle with respect to a direction perpendicular to the surface of the semiconductor layer. Furthermore, a semiconductor device is provided including an N-channel transistor comprising a halo region made of a halo species with a dopant profile formed in a semiconductor layer and a carbon species implanted in the semiconductor layer with substantially the same dopant profile as the dopant profile of the halo region.

Abstract: A method of forming a semiconductor device is provided including co-implanting a halo species and carbon in a semiconductor layer with a finite tilt angle with respect to a direction perpendicular to the surface of the semiconductor layer. Furthermore, a semiconductor device is provided including an N-channel transistor comprising a halo region made of a halo species with a dopant profile formed in a semiconductor layer and a carbon species implanted in the semiconductor layer with substantially the same dopant profile as the dopant profile of the halo region.

Abstract: A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.

Abstract: A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54?, 54?) and channels (56, 56?, 56?) between adjacent sectors.

Abstract: A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.

Abstract: A heat dissipation assembly includes a heat sink having a base and a plurality of heat dissipation fins disposed on the base, thermal interface material applied to the base opposing the fins, and a cap covering the base. The cap includes a body which shields the thermal interface material, and first and second wings extending from the body. The first wing is rotatable relative to the body to facilitate detaching the cap from the base of the heat sink.

Abstract: A heat sink clip (10) includes a pressing section (11) and first and second spring sections (12, 14). A first arm (15) depends from the first spring section. An operation lever (24) defines a pair of second pivot holes (244) and a pair of third pivot holes (246) at one end. The third pivot holes are closer to said one end of the lever. A connecting portion (20) has one end pivotably connected to the second spring section, and the other end pivotably connected at the third pivot holes of the lever. A second arm (25) is pivotably connected to the second pivot holes. The first and second arms define slots (18, 28) to engagingly receive posts (82) of a back plate (80). When the lever is rotated downwardly, the second arm of the clip is raised, and a heat sink (30) is thereby secured to a CPU (60).

Abstract: A heat sink clip (10) includes a pressing section (11) and first and second spring sections (12, 14). A first arm (15) depends from the first spring section. An operation lever (24) defines a pair of second pivot holes (244) and a pair of third pivot holes (246) at one end. The third pivot holes are closer to said one end of the lever. A connecting portion (20) has one end pivotably connected to the second spring section, and the other end pivotably connected at the third pivot holes of the lever. A second arm (25) is pivotably connected to the second pivot holes. The first and second arms define slots (18, 28) to engagingly receive posts (82) of a back plate (80). When the lever is rotated downwardly, the second arm of the clip is raised, and a heat sink (30) is thereby secured to a CPU (60).

Abstract: A retaining device includes a retention frame (20), a back plate (40), a clip (10) and a wire arm (30). The retention frame forms a pair of protrusions (24, 25) at respective opposite sides thereof and an ear (26) at one of said sides of the retention frame. A pair of posts (44) extends from the back plate and further protrudes from the protrusions. The clip comprises a pressing lever (12) and a pair of legs (14, 16) depending from the lever. A pair of hooks (142, 162) is inwardly formed from the legs for engaging with the posts. The wire arm comprises a locating portion (34) positioned on the retention frame, a pressing portion (32) resting on the clip and an operating portion (36) clamped under the ear of the retention frame. The locating portion and the operating portion extend in opposite directions from the pressing portion.

Abstract: An electrical card connector includes an insulative housing (3), a plurality of terminals (5) received in the housing, and two fixing clips (7) attached to the housing. The insulative housing has a header (15) including a pivot (25), a plurality of passageways (21) for receiving the terminals therein, and two guiding bars (17) extending from two ends of the header each having a ledge (23) at a front end thereof. The pivot projects from each end of the header to provide a rotational axis for the fixing clip. The ledge includes a first positioning recess (45), a sliding face (47) and a second positioning recess (49). Each fixing clip has a base plate (29) fixed to a PCB, a joint section (33) extending from the base plate to prevent over-rotation of the housing, and an engaging section (35) for engaging with the insulative housing.

Abstract: A heat sink includes a base plate (30), and a plurality of fins (10) mounted on the base plate. Each fin includes a main body (12), and two upper locking members (14). Two retaining holes (22) are defined in the main body. Each locking member includes a horizontal part (16), and a vertical part (18). A slot (15) is defined in the horizontal part. A key (20) is formed in the vertical part. In assembly, a second fin is moved relative to a first fin until the locking members of the second fin are received in the corresponding slots of the first fin, and the keys of the second fin snappingly engage in the corresponding retaining holes of the main body of the first fin. Thus, the two fins are interlocked together. The other fins are then sequentially interlocked with the second fin onward, in similar fashion.

Abstract: A method and apparatus for low cost, convenient prospecting and surveys of subsurface structures using seismoelectric signals, as well as laboratory analysis of geological samples. The seismoelectric signals come from seismic waves generated by sources which can be applied or natural. The seismoelectric signals are generated with the same velocity and frequency of the generating seismic waves, then induce secondary electromagnetic signals which travel at their own much higher speed. The seismoelectric signals thus may be measured with electrodes or antennas. Electrodes may be disposed within a borehole or on the surface. The method allows use of geophone data, but does not require it. The it source of the seismoelectric signals, being a moving seismic wave front, conveys continuous, whole body information on the structures underground, in much the same way as seismic ware data, but in the form of simpler, easier to capture seismoelectric signals. Reflection and refraction of seismic waves can be ascertained.

Abstract: An electrical card connector includes an insulative housing (3), a plurality of terminals (5) received in the housing, and two fixing clips (7) attached to the housing. The insulative housing has a header (15) including a pivot (25), a plurality of passageways (21) for receiving the terminals therein, and two guiding bars (17) extending from two ends of the header each having a ledge (23) at a front end thereof. The pivot projects from each end of the header to provide a rotational axis for the fixing clip. The ledge includes a first positioning recess (45), a sliding face (47) and a second positioning recess (49). Each fixing clip has a base plate (29) fixed to a PCB, a joint section (33) extending from the base plate to prevent over-rotation of the housing, and an engaging section (35) for engaging with the insulative housing.