Patents by Inventor Chien Ho

Chien Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150592
    Abstract: Provided is a photocurable conductive black composition including: (a) at least one (meth)acrylate-functionalized urethane oligomer; (b) at least one photopolymerizable compound; (c) a photoinitiator; (d) a visible-light blocking system; (e) conductive fillers; and optionally (f) a thermal initiator. Also provided are a method for forming a cured product composed of the photocurable conductive black compositions, and an article comprising the cured product.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 9, 2024
    Inventors: Chien-Ho HUANG, Yi-Ting CHEN, Tsung-Han TSAI, Li-Yen LIN
  • Patent number: 11976478
    Abstract: A building formwork apparatus includes a building formwork having a frame with a positioning hole and a locking hole, and a locking member including a first tapered section, a second tapered section connected to the first tapered section, and a threaded portion connected to the second tapered section. The positioning hole is configured to receive insertion of the locking member therethrough such that the first tapered section is retained therein and the second tapered section is exposed therefrom for connection with another building formwork apparatus. The locking hole is configured to receive a threaded portion and a second tapered section of a locking member of the another building formwork apparatus.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: May 7, 2024
    Inventor: Chien-Ho Wang
  • Publication number: 20240145379
    Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Publication number: 20240128094
    Abstract: A method for forming integrated circuit (IC) packages includes mounting dies on a strip of interconnects and applying wire bonds in regions of the strip of interconnects proximate to mold shields. The method also includes adjusting the mold shields of the strip of interconnects. The method includes flowing a mold compound on the strip of interconnects to form a strip of IC packages. Mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects across the strip of interconnects to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through the regions of the strip of interconnects proximate to the mold shields. The method includes singulating the strip of IC packages to form the IC packages.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Inventor: CHIH-CHIEN HO
  • Patent number: 11948721
    Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: April 2, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Ying-Chuan Kao, Hung-Yu Chou, Dong-Ren Peng, Jun Jie Kuo, Kenji Otake, Chih-Chien Ho
  • Patent number: 11940828
    Abstract: A voltage tracking circuit is provided. The voltage tracking circuit includes first and second P-type transistors and a control circuit. The drain of the first P-type transistor is coupled to a first voltage terminal. The gate and the drain of the second P-type transistor are respectively coupled to the first voltage terminal and a second voltage terminal. The control circuit is coupled to the first and second voltage terminals and generates a control voltage according to the first voltage and the second voltage. The sources of the first and second P-type transistors are coupled to an output terminal of the voltage tracking circuit, and the output voltage is generated at the output terminal. In response to the second voltage being higher than the first voltage, the control circuit generates the control signal to turn off the first P-type transistor.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: March 26, 2024
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Shao-Chang Huang, Yeh-Ning Jou, Ching-Ho Li, Kai-Chieh Hsu, Chun-Chih Chen, Chien-Wei Wang, Gong-Kai Lin, Li-Fan Chen
  • Publication number: 20240085721
    Abstract: The eyeglasses includes a glasses frame and two temples. The glasses frame has two opposite ends. Each of the two temples has a front end connected pivotally to a respective one of the two opposite ends of the glasses frame. Each of the two temples have a section that is flexible so that, by applying lateral forces to the two temples, the temples are convertible between an outwardly curved state where rear ends of the two temples are spaced apart from each other at a first distance, and an inwardly curved state where the rear ends of the two temples are spaced apart from each other at a second distance that is smaller than the first distance.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 14, 2024
    Inventors: David CHAO, Chien-Ho LIN, Chien-Liang YEH
  • Publication number: 20240072115
    Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.
    Type: Application
    Filed: February 13, 2023
    Publication date: February 29, 2024
    Inventors: Wei-Xiang You, Wei-De Ho, Hsin Yang Hung, Meng-Yu Lin, Hsiang-Hung Huang, Chun-Fu Cheng, Kuan-Kan Hu, Szu-Hua Chen, Ting-Yun Wu, Wei-Cheng Tzeng, Wei-Cheng Lin, Cheng-Yin Wang, Jui-Chien Huang, Szuya Liao
  • Patent number: 11908705
    Abstract: A method for aligning interconnects that includes trimming and forming a frame of strips of interconnects. The frame of strips of interconnects includes interdigitated pins. The method also includes removing siderails from the frame of strips of interconnects to provide an array of strips of interconnects. The method includes aligning a first set of strips of interconnects in the array of strips of interconnects such that pins of the first set of strips of interconnects are aligned with pins of a second set of strips of interconnects in the array of strips of interconnects. A strip of interconnects of the first set of strips of interconnects are adjacent to a strip of interconnects of the second set of strips of interconnects to provide an aligned array of strips of interconnects. The method further includes singulating the aligned array of strips of interconnects.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: February 20, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Chih-Chien Ho
  • Publication number: 20240052851
    Abstract: A fan housing is disclosed and includes a barrel body and a fixing plate. The barrel body includes a first end, a second end and a hollow portion. The first end and the second end are two opposite ends, and the hollow portion is in communication between the first end and the second end, and configured to accommodate a fan motor. The fixing plate includes a plurality of splicing elements. Each two adjacent ones of the plurality of splicing elements are connected to each other. The plurality of splicing elements are disposed around the barrel body and connected to the first end or the second end.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 15, 2024
    Inventors: Yueh-Chih Hung, Chien-Ho Lee
  • Patent number: 11867562
    Abstract: An optical device is provided. The optical device includes a time-of-flight (TOF) sensor array, a photon conversion thin film, and a light source. The photon conversion thin film is disposed above the time-of-flight sensor array. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: January 9, 2024
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Lai-Hung Lai, Chin-Chuan Hsieh, Chien-Ho Yu
  • Publication number: 20230412034
    Abstract: The present disclosure provides an external rotor motor including a rotor, an air guider, a pillow and a stator. The rotor includes a hub. The air guider includes a connecting ring and rotor air-guiding members. The connecting ring is disposed on the hub. The rotor air-guiding members are disposed on the connecting ring. A first gap is formed among any two adjacent rotor air-guiding members and the connecting ring. The pillow includes a stator flange, a cylinder and fins. The stator flange is disposed on the cylinder. The fins are radially arranged on a first surface of the stator flange. A second gap is formed among any two adjacent fins and the stator flange. A first acute angle is formed between a radial extension direction of each of the fins and a first tangent direction of the cylinder. The stator is mounted on the pillow and rotates along an axis.
    Type: Application
    Filed: November 9, 2022
    Publication date: December 21, 2023
    Inventors: Chih-Yu Chien, Chien-Ho Lee, Yi-Ta Lu
  • Patent number: 11817374
    Abstract: A packaged electronic device has a package structure, first leads, second leads and a tie bar. The package structure has a first side, a second side, a third side, a fourth side, a fifth side and a sixth side, the second side spaced from the first side along a first direction, the fourth side spaced from the third side along an orthogonal second direction, and the sixth side spaced from the fifth side along an orthogonal third direction. The first leads extend outward in a first plane of the second and third directions from respective portions of the third side, the second leads extend outward in the first plane from respective portions of the fourth side, and the tie bar is exposed along the fifth side in a second plane of the second and third directions, the second plane between the first plane and the first side.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: November 14, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Chih-Chien Ho, Bo-Hsun Pan, Yuh-Harng Chien
  • Publication number: 20230317571
    Abstract: An electronic device with a conductive lead having an internal first section and an external second section extending outside a molded package structure, the first section having an obstruction feature extending vertically from a top or bottom side of the conductive lead and engaging a portion of the package structure to oppose movement of the conductive lead outward from the package structure.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 5, 2023
    Inventors: Hsiang Ming Hsiao, Hung-Yu Chou, Yuh-Harng Chien, Chih-Chien Ho, Che Wei Tu, Bo-Hsun Pan, Megan Chang
  • Publication number: 20230265667
    Abstract: A one-way retractable building formwork apparatus for mounting on a mounting surface of a substrate module includes a first side bar disposed on one end of the mounting surface that extends along a lateral direction, a second side bar disposed on another end of the mounting surface and opposite to the first side bar along an extending direction transverse to the lateral direction, and a retractable unit that is disposed on the mounting surface, that is connected to the first side bar, and that is extendable along the extending direction to fixedly connect to the second side bar.
    Type: Application
    Filed: January 10, 2023
    Publication date: August 24, 2023
    Inventor: Chien-Ho WANG
  • Publication number: 20230265668
    Abstract: A two-way retractable building formwork apparatus includes a substrate module having a mounting surface, a first side bar mounted on one end of the mounting surface that extends along a first direction, a second side bar mounted on another end of the mounting surface that extends along a second direction transverse to the first direction and fixed to one end of the first side bar, a first retractable unit mounted on the mounting surface opposite to the first side bar and extendable along the first direction to fixedly connect to the second side bar, and a second retractable unit mounted on the mounting surface opposite to the second side bar, extendable along the second direction to fixedly connect to the first side bar, and further connected to the first retractable unit.
    Type: Application
    Filed: January 10, 2023
    Publication date: August 24, 2023
    Inventor: Chien-Ho WANG
  • Publication number: 20230236066
    Abstract: An optical device is provided. The optical device includes a time-of-flight (TOF) sensor array, a photon conversion thin film, and a light source. The photon conversion thin film is disposed above the time-of-flight sensor array. The light source emits light with a first wavelength towards the photon conversion thin film to be converted into light with a second wavelength received by the time-of-flight sensor array. The second wavelength is longer than the first wavelength.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 27, 2023
    Inventors: Lai-Hung LAI, Chin-Chuan HSIEH, Chien-Ho YU
  • Patent number: D996197
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: August 22, 2023
    Inventor: Chien-Ho Wang
  • Patent number: D1010434
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: January 9, 2024
    Inventor: Chien-Ho Wang