Abstract: An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of wherein R1 is each of R4 is independently C1-6 alkylene group, m is an integer of 0 to 10, and m? is an integer of 1 to 10; n is an integer of 1 to 10, each of R2 is independently hydrogen, saturated or unsaturated C1-6 hydrocarbon group, CF3, silanol group, silyl group, or Al(OH)3; and R3 is silanol group, silyl group, or Al(OH)3. The anhydride compound can be reacted with a diamine compound to form a polyimide.

Abstract: The disclosure provides a film composition, wherein the film composition includes an oligomer and a crosslinking agent. The oligomer can have a structure represented by Formula (I) wherein R1 and R2 are independently hydrogen, C1-20 alkyl group, C2-20 alkenyl group, C6-12 aryl group, C6-12 alkylaryl group, C5-12 cycloalkyl group, C6-20 cycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; R1 is not hydrogen when R2 is hydrogen; a is 0 or 1; 100?n?1; 100?m?1; and when n is not 0, the ratio of n to m is from 3:1 to 1:4. The weight ratio of the oligomer and the crosslinking agent can be from 9:1 to 3:7. The oligomer has a number average molecular weight (Mn) from 1,000 to 8,000.

Abstract: The disclosure provides a film composition, wherein the film composition includes an oligomer and a crosslinking agent. The oligomer can have a structure represented by Formula (I) , wherein R1 and R2 are independently hydrogen, C1-20 alkyl group, C2-20 alkenyl group, C6-12 aryl group, C6-12 alkylaryl group, C5-12 cycloalkyl group, C6-20 cycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; R1 is not hydrogen when R2 is hydrogen; a is 0 or 1; 100?n?1; 100?m?1; and when n is not 0, the ratio of n to m is from 3:1 to 1:4. The weight ratio of the oligomer and the crosslinking agent can be from 9:1 to 3:7. The oligomer has a number average molecular weight (Mn) from 1,000 to 8,000.