Patents by Inventor Chi-Fan Wu

Chi-Fan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3DIC packaging with hot spot thermal management features
    Patent number: 11961779
    Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).
    Inventors: Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
  • Electrical connector with changeover of circuit board
    Patent number: 7833049
    Abstract: An electrical connector comprises a circuit board and a first housing, wherein the circuit board has a butt portion and a lap portion, the butt portion is formed thereon with a plurality of first contacts, the lap portion is formed thereon with a plurality of second contacts, the first contacts and the second contacts are connected with each other, the second spacing between the adjacent second contacts is larger than the first spacing between the adjacent first contacts, and the first contacts are arranged to couple to a butt connector. The first housing is assembled on the circuit board and positioned above the lap portion.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: November 16, 2010
    Assignee: P-Two Industries, Inc.
    Inventors: Chien-Chun Wang, Shao-Kai Chen, Chi-Fan Wu
  • ELECTRICAL CONNECTOR
    Publication number: 20100184333
    Abstract: An electrical connector comprises a circuit board and a first housing, wherein the circuit board has a butt portion and a lap portion, the butt portion is formed thereon with a plurality of first contacts, the lap portion is formed thereon with a plurality of second contacts, the first contacts and the second contacts are connected with each other, the second spacing between the adjacent second contacts is larger than the first spacing between the adjacent first contacts, and the first contacts are arranged to couple to a butt connector.
    Type: Application
    Filed: August 17, 2009
    Publication date: July 22, 2010
    Applicant: P-TWO INDUSTRIES INC.
    Inventors: CHIEN-CHUN WANG, Shao-Kai Chen, Chi-Fan Wu