Abstract: An illumination system, a projection device, and a projection control method are provided. The illumination system includes a first light-emitting unit, a second light-emitting unit, a third light-emitting unit, a first dichroic element, a second dichroic element, and a control unit. The first light-emitting unit includes a first light-emitting element and a second light-emitting element. The control unit is electrically connected to the first light-emitting unit and configured to switch the illumination system between a high-performance mode and a high-chroma mode, wherein when the illumination system is in the high-performance mode, the control unit controls a current ratio of the second light-emitting element to be greater than a current ratio of the first light-emitting element, and when the illumination system is in the high-chroma mode, the control unit controls the current ratio of the second light-emitting element to be less than the current ratio of the first light-emitting element.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: An illumination system provides an illumination beam and includes a red light source, a green light source, a blue light source, a first supplementary light source, a first X-shaped light-splitting assembly, a first light-splitting element, and a light-uniforming element. The red light source provides a red beam. The green light source provides a green beam. The blue light source provides a blue beam. The first supplementary light source provides a first supplementary beam. The first X-shaped light-splitting assembly guides the first supplementary beam and the blue beam to the first light-splitting element. The first light-splitting element guides the red beam, the green beam, the blue beam, and the first supplementary beam to the light-uniforming element. The first supplementary beam is a red supplementary beam or a blue supplementary beam, and the illumination system includes at least five light-emitting elements. A projection apparatus including the above illumination system is also provided.

Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.

Abstract: A transistor includes a gate structure over a substrate, wherein the substrate includes a channel region. The transistor further includes a source/drain (S/D) in the substrate adjacent to the gate structure. The transistor further includes a lightly doped drain (LDD) region adjacent to the S/D, wherein a dopant concentration in the first LDD is less than a dopant concentration in the S/D. The transistor further includes a doping extension region adjacent the LDD region, wherein the doping extension region extends farther under the gate structure than the LDD region, and a maximum depth of the doping extension region is 10-times to 30-times greater than a maximum depth of the LDD.

Abstract: A driving method for a multiple frequency coupling generator is provided. The method includes: in normal operations, interpreting an input digital control signal transmitted from a digital signal processor into an interpreted digital control signal; interpreting the interpreted digital control signal into a plurality of magnetic coupling signals by a magnetic coupling switch circuit; performing signal recovery and differential delay on the magnetic coupling signals by an interlocking circuit for reducing time difference and signal loss of the magnetic coupling signals; and when the interlocking circuit determines that the magnetic coupling signals have substantially no time difference and no signal loss, transforming the magnetic coupling signals into a first driving signal and a second driving signal by a switch circuit, a driver circuit and an output pad group to drive a backend driving loop.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: An illumination system for providing an illumination beam includes red, blue, and green light source modules, a first light combining element, and a light uniforming element. The red light source module includes a first red light emitting element emitting first red light and a second red light emitting element emitting second red light. A peak wavelength of the second red light is greater than a peak wavelength of the first red light. The blue light source module includes a first blue light emitting element emitting first blue light and a second blue light emitting element emitting second blue light. A peak wavelength of the second blue light is less than a peak wavelength of the first blue light. The green light source module generates green light. The first light combining element guides these lights into the light uniforming element, so that the illumination system outputs the illumination beam.

Abstract: A projection device, including an illumination system, a control element, a driving element, a light valve, and a projection lens, is provided. The illumination system includes multiple light sources for providing multiple light beams to be combined into an illumination light beam. The driving element respectively drives the light sources in a first mode or a second mode, so that the light beams have respective luminous brightness, and the driving element is switched from the first mode to the second mode according to a first signal. The control element provides the first signal to the driving element according to an optical state or a time state of the projection device. The light valve is adapted to convert the illumination light beam into an image light beam. The projection lens is adapted to project the image light beam out of the projection device.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A heat dissipation apparatus includes a vapor chamber and multiple flow field fins. The vapor chamber includes a lower plate part and an upper plate part. The lower plate part includes multiple flow channels, a first and a second confluence areas formed on the flow channels. The upper plate part covers on the lower plate part to enclose the flow channels, the first and second confluence areas. Each flow field fin includes an inlet channel, an outlet channel, and a circuitous channel. The inlet channel communicates with the first confluence area, the outlet channel communicates with the second confluence area, and the circuitous channel communicates between the inlet channel and the outlet channel in a single flow direction. The flow field fins are collectively as an inlet surface at one side adjacent to the outlet channel and as an outlet surface at another side adjacent to the inlet channel.

Abstract: A temperature controlling method of a liquid cooling device includes a providing step, a disposing step and a processing and controlling step. In the providing step: a microprocessor and multiple flexible micro sensors are provided. In the disposing step: the microprocessor is disposed on the liquid cooling device (including an evaporator, a condenser, a cold water tube, a hot water tube, a pumping motor and a cooling fan motor), and the micro sensors are separately disposed in the cold water tube and the hot water tube to directly contact with the liquid. In the processing and controlling step: the microprocessor receives data sensed in the cold water tube and the hot water tube by the micro sensors to calculate, and controls the pumping motor and the cooling fan motor to modulate an operating performance according to a calculated result.

Abstract: An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.

Abstract: An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.

Abstract: Various embodiments of the present technology provide systems and methods for configuring a power supply unit (PSU) of a rack system. The rack system contains one or more nodes, each of which can has a first housing and a second housing. The first housing stores a power supply unit (PSU) that can be easily accessed by a technician or a user from a front of the rack system. The second housing stores a plurality of computer-readable memory devices and has a first portion and a second portion. The first housing is positioned in the front of the rack system and in a central portion of the rack system between the first portion and the second portion of the second housing.

Abstract: An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.

Abstract: In some implementations, cooling fans can be mounted in a server chassis using a multi-level vibration dampening mechanism to reduce the transmission of fan vibrations to the server chassis. For example, a plurality of cooling fans can be housed within a plurality of fan cages. The plurality of fan cages can be mounted to a cooling fan tray. The cooling fan tray can be mounted to the chassis. For example, the mountings used to attach the fan cages to the tray and the tray to the chassis can include resilient vibration dampers. Thus, the vibrations generated by the cooling fans can be more effectively reduced and operation of vibration sensitive server components can be improved.

Abstract: Various embodiments of the present technology provide systems and methods for mounting and dismounting a computing component (e.g., a HDD) of a server system. The server system contains one or more drawers, each of which can host a plurality of computing components. A computing component can have a side surface attached to a lever via a hinge. When the computing component is placed into a designated location of a drawer, pressing a first end of the lever in one direction can cause a second end of the lever to interact with at least one portion of the drawer and further cause the computing component to move into a close position or out of the close position.

Abstract: A server assembly including a housing having a slidable tray transitionable between an open configuration and a closed configuration. A plurality of tray bodies disposed in the slidable tray, each of the plurality of tray bodies configured to removably receive at least one component module. The plurality of tray bodies arranged in rows, one behind the other, thereby having an first tray body and a second tray body. The second tray body is transitionable between a loading configuration and stored configuration. The storing configuration, the second tray body is arranged adjacent to the first tray body such that the receiving assembly is inaccessible. The loading configuration, the second tray body is translated relative to the tray and the first tray body such that the receiving assembly is accessible.