Patents by Inventor Chi-Fu Chen
Chi-Fu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12196496Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.Type: GrantFiled: September 25, 2022Date of Patent: January 14, 2025Assignee: AIC INC.Inventors: Yen-Chih Chen, Chi-Fu Chen, Wei-Ta Chen, Hung-Hui Chang
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Publication number: 20240102742Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.Type: ApplicationFiled: September 25, 2022Publication date: March 28, 2024Inventors: Yen-Chih CHEN, Chi-Fu CHEN, Wei-Ta CHEN, Hung-Hui CHANG
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Publication number: 20230280107Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.Type: ApplicationFiled: March 2, 2022Publication date: September 7, 2023Inventors: Yen-Chih CHEN, Hsih-Ting YOU, Chi-Fu CHEN, Wei-Ta CHEN, Chien-Yang LIN
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Patent number: 11732976Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.Type: GrantFiled: March 2, 2022Date of Patent: August 22, 2023Assignee: AIC INC.Inventors: Yen-Chih Chen, Hsih-Ting You, Chi-Fu Chen, Wei-Ta Chen, Chien-Yang Lin
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Publication number: 20230098311Abstract: A heat dissipation apparatus includes a vapor chamber and multiple flow field fins. The vapor chamber includes a lower plate part and an upper plate part. The lower plate part includes multiple flow channels, a first and a second confluence areas formed on the flow channels. The upper plate part covers on the lower plate part to enclose the flow channels, the first and second confluence areas. Each flow field fin includes an inlet channel, an outlet channel, and a circuitous channel. The inlet channel communicates with the first confluence area, the outlet channel communicates with the second confluence area, and the circuitous channel communicates between the inlet channel and the outlet channel in a single flow direction. The flow field fins are collectively as an inlet surface at one side adjacent to the outlet channel and as an outlet surface at another side adjacent to the inlet channel.Type: ApplicationFiled: September 27, 2021Publication date: March 30, 2023Inventors: Yen-Chih CHEN, Hsih-Ting YOU, Chi-Fu CHEN
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Publication number: 20220346279Abstract: A temperature controlling method of a liquid cooling device includes a providing step, a disposing step and a processing and controlling step. In the providing step: a microprocessor and multiple flexible micro sensors are provided. In the disposing step: the microprocessor is disposed on the liquid cooling device (including an evaporator, a condenser, a cold water tube, a hot water tube, a pumping motor and a cooling fan motor), and the micro sensors are separately disposed in the cold water tube and the hot water tube to directly contact with the liquid. In the processing and controlling step: the microprocessor receives data sensed in the cold water tube and the hot water tube by the micro sensors to calculate, and controls the pumping motor and the cooling fan motor to modulate an operating performance according to a calculated result.Type: ApplicationFiled: April 21, 2021Publication date: October 27, 2022Inventors: Yen-Chih CHEN, Hsih-Ting YOU, Chi-Fu CHEN
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Patent number: 10440851Abstract: An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.Type: GrantFiled: March 5, 2018Date of Patent: October 8, 2019Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Chih-Ming Chen, Yaw-Tzorng Tsorng, Ta-Chih Chen, Chi-Fu Chen, Hou-Hsien Chang
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Publication number: 20180199459Abstract: An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.Type: ApplicationFiled: March 5, 2018Publication date: July 12, 2018Inventors: Chao-Jung CHEN, Chih-Ming CHEN, Yaw-Tzorng TSORNG, Ta-Chih CHEN, Chi-Fu CHEN, Hou-Hsien CHANG
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Patent number: 9936602Abstract: Various embodiments of the present technology provide systems and methods for configuring a power supply unit (PSU) of a rack system. The rack system contains one or more nodes, each of which can has a first housing and a second housing. The first housing stores a power supply unit (PSU) that can be easily accessed by a technician or a user from a front of the rack system. The second housing stores a plurality of computer-readable memory devices and has a first portion and a second portion. The first housing is positioned in the front of the rack system and in a central portion of the rack system between the first portion and the second portion of the second housing.Type: GrantFiled: September 3, 2015Date of Patent: April 3, 2018Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Chung-Kai Chen, Chi-Fu Chen
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Patent number: 9913396Abstract: An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.Type: GrantFiled: December 22, 2015Date of Patent: March 6, 2018Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Chih-Ming Chen, Yaw-Tzorng Tsorng, Ta-Chih Chen, Chi-Fu Chen, Hou-Hsien Chang
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Patent number: 9874229Abstract: In some implementations, cooling fans can be mounted in a server chassis using a multi-level vibration dampening mechanism to reduce the transmission of fan vibrations to the server chassis. For example, a plurality of cooling fans can be housed within a plurality of fan cages. The plurality of fan cages can be mounted to a cooling fan tray. The cooling fan tray can be mounted to the chassis. For example, the mountings used to attach the fan cages to the tray and the tray to the chassis can include resilient vibration dampers. Thus, the vibrations generated by the cooling fans can be more effectively reduced and operation of vibration sensitive server components can be improved.Type: GrantFiled: May 27, 2015Date of Patent: January 23, 2018Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Ming-Sheng Chang, Chi-Fu Chen
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Patent number: 9804642Abstract: Various embodiments of the present technology provide systems and methods for mounting and dismounting a computing component (e.g., a HDD) of a server system. The server system contains one or more drawers, each of which can host a plurality of computing components. A computing component can have a side surface attached to a lever via a hinge. When the computing component is placed into a designated location of a drawer, pressing a first end of the lever in one direction can cause a second end of the lever to interact with at least one portion of the drawer and further cause the computing component to move into a close position or out of the close position.Type: GrantFiled: July 1, 2015Date of Patent: October 31, 2017Assignee: QUANTA COMPUTER, INC.Inventors: Chao-Jung Chen, Chi-Fu Chen
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Patent number: 9781857Abstract: A server assembly including a housing having a slidable tray transitionable between an open configuration and a closed configuration. A plurality of tray bodies disposed in the slidable tray, each of the plurality of tray bodies configured to removably receive at least one component module. The plurality of tray bodies arranged in rows, one behind the other, thereby having an first tray body and a second tray body. The second tray body is transitionable between a loading configuration and stored configuration. The storing configuration, the second tray body is arranged adjacent to the first tray body such that the receiving assembly is inaccessible. The loading configuration, the second tray body is translated relative to the tray and the first tray body such that the receiving assembly is accessible.Type: GrantFiled: August 24, 2015Date of Patent: October 3, 2017Assignee: QUANTA COMPUTER, INC.Inventors: Maw-Zan Jau, Chao-Jung Chen, Chih-Ming Chen, Chung-Chih Chen, Chi-Fu Chen
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Patent number: 9713279Abstract: An apparatus configured such that hardware components of a server can be accessed from the front of the server. The apparatus comprises a server tower having a front side, a rear side, and at least one chassis. The chassis comprises a motherboard and at least one hard drive housed in the chassis at the front side, the hard drive adapted to be spaced apart above the motherboard. A bracket can support the hard drive. The motherboard I/O and the hard drive are accessible from the front side. The hard drive can be configured in the apparatus such that the hard drive is removable and hot-swappable. The apparatus can comprise at least one coupling port used to couple peripheral devices located at the front side. The apparatus can comprise a front panel attached to the front side through which the at least one coupling port can be accessed.Type: GrantFiled: December 30, 2014Date of Patent: July 18, 2017Assignee: QUANTA COMPUTER INC.Inventors: Chen Tseng, Chao-Jung Chen, Yaw-Tzorng Tsorng, Chi-Fu Chen
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Publication number: 20170181312Abstract: An apparatus for reverse mounting an electronic device in a server housing is provided. The apparatus includes a first bracket, a second bracket, and a coupling. The first bracket couples to the device body and extends outward from the device body toward a front rail of the server housing. The first bracket includes a first end configured to releasably couple to front rail of the server housing. The second bracket includes a protrusion that extends outward from the device body in an opposite direction relative to the first bracket. The coupling includes a first portion that couples to a rear rail of the server housing and a second portion defining a channel that receives the protrusion of the second bracket.Type: ApplicationFiled: December 22, 2015Publication date: June 22, 2017Inventors: Chao-Jung CHEN, Chih-Ming CHEN, Yaw-Tzorng TSORNG, Ta-Chih CHEN, Chi-Fu CHEN, Hou-Hsien CHANG
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Publication number: 20170097003Abstract: A server rack assembly having a housing configured to receive at least one server sled. A first fan associated with the housing, the first fan having a first size and a second fan having a second size. The first fan and the second fan are operated at different speeds to maintain a predetermined temperature in the server rack assembly.Type: ApplicationFiled: October 2, 2015Publication date: April 6, 2017Inventors: Chao-Jung CHEN, Yi-Chieh CHEN, Chi-Fu CHEN
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Publication number: 20170071073Abstract: Various embodiments of the present technology provide systems and methods for configuring a power supply unit (PSU) of a rack system. The rack system contains one or more nodes, each of which can has a first housing and a second housing. The first housing stores a power supply unit (PSU) that can be easily accessed by a technician or a user from a front of the rack system. The second housing stores a plurality of computer-readable memory devices and has a first portion and a second portion. The first housing is positioned in the front of the rack system and in a central portion of the rack system between the first portion and the second portion of the second housing.Type: ApplicationFiled: September 3, 2015Publication date: March 9, 2017Inventors: Chao-Jung CHEN, Chung-Kai CHEN, Chi-Fu CHEN
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Patent number: 9546674Abstract: The interlocking device for a tray in a supporting structure while enabling the tray to be removed from the supporting structure. The tray can include a device that engages with at least one engaging device in the supporting structure. The tray is inserted into the supporting structure using the guide or other engaging device. When the tray is fully inserted into the supporting structure, the tray can be secured to the supporting structure by the interlocking device. The interlocking device secures the tray to the supporting structure by a locking mechanism that selectively engages a first recess and a handle that selectively engages a second recess in the supporting structure. When the tray is to be removed from the supporting structure, the interlocking device disengages from the first and second recesses and enables the tray to be removed without interference of the tray and the supporting structure.Type: GrantFiled: August 24, 2015Date of Patent: January 17, 2017Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yaw-Tzorng Tsorng, Chi-Fu Chen, Hou-Hsien Chang
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Publication number: 20160348696Abstract: In some implementations, cooling fans can be mounted in a server chassis using a multi-level vibration dampening mechanism to reduce the transmission of fan vibrations to the server chassis. For example, a plurality of cooling fans can be housed within a plurality of fan cages. The plurality of fan cages can be mounted to a cooling fan tray. The cooling fan tray can be mounted to the chassis. For example, the mountings used to attach the fan cages to the tray and the tray to the chassis can include resilient vibration dampers. Thus, the vibrations generated by the cooling fans can be more effectively reduced and operation of vibration sensitive server components can be improved.Type: ApplicationFiled: May 27, 2015Publication date: December 1, 2016Inventors: Chao-Jung CHEN, Ming-Sheng CHANG, Chi-Fu CHEN
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Publication number: 20160306397Abstract: Systems and methods for distributing power within a rack system, including a power distribution unit (“PDU”) and multiple servers, are provided. The internal power cable contains a first or a second power socket at one of its ends. The first power socket can be located on the same side as t the PDU while the second power socket can be located close to a PSU of the PSUs that are located on a different side of the PDU. The first power socket of the internal power cable can be connected to the PDU via a first short power cable. The PSU located on the different side of the PDU can be connected to the PDU via a second short power cable between the second power socket of the internal power cable and a power socket of the PSU, the internal power cable, and the first short power cable.Type: ApplicationFiled: April 16, 2015Publication date: October 20, 2016Inventors: Chao-Jung CHEN, Chi-Fu CHEN