Abstract: A semiconductor arrangement includes a first well formed to a first depth and a first width in a substrate and a second well formed to a second depth and a second width in the substrate. The first well is formed in the second well, the first depth is greater than the second depth, and the second width is greater than the first width. A source region is formed in the second well and a drain region is formed in the substrate.

Abstract: A semiconductor arrangement includes a first well formed to a first depth and a first width in a substrate and a second well formed to a second depth and a second width in the substrate. The first well is formed in the second well, the first depth is greater than the second depth, and the second width is greater than the first width. A source region is formed in the second well and a drain region is formed in the substrate.

Abstract: A deep trench structure may be formed between electrodes of a capacitive device. The deep trench structure may be formed to a depth, a width, and/or an aspect ratio that increases the volume of the deep trench structure relative to a trench structure formed using a metal etch-stop layer. Thus, the deep trench structure is capable of being filled with a greater amount of dielectric material, which increases the capacitance value of the capacitive device. Moreover, the parasitic capacitance of the capacitive device may be decreased by omitting the metal etch-stop layer. Accordingly, the deep trench structure (and the omission of the metal etch-stop layer) may increase the sensitivity of the capacitive device, may increase the humidity-sensing performance of the capacitive device, and/or may increase the performance of devices and/or integrated circuits in which the capacitive device is included.

Abstract: A deep trench structure may be formed between electrodes of a capacitive device. The deep trench structure may be formed to a depth, a width, and/or an aspect ratio that increases the volume of the deep trench structure relative to a trench structure formed using a metal etch-stop layer. Thus, the deep trench structure is capable of being filled with a greater amount of dielectric material, which increases the capacitance value of the capacitive device. Moreover, the parasitic capacitance of the capacitive device may be decreased by omitting the metal etch-stop layer. Accordingly, the deep trench structure (and the omission of the metal etch-stop layer) may increase the sensitivity of the capacitive device, may increase the humidity-sensing performance of the capacitive device, and/or may increase the performance of devices and/or integrated circuits in which the capacitive device is included.

Abstract: A deep trench structure may be formed between electrodes of a capacitive device. The deep trench structure may be formed to a depth, a width, and/or an aspect ratio that increases the volume of the deep trench structure relative to a trench structure formed using a metal etch-stop layer. Thus, the deep trench structure is capable of being filled with a greater amount of dielectric material, which increases the capacitance value of the capacitive device. Moreover, the parasitic capacitance of the capacitive device may be decreased by omitting the metal etch-stop layer. Accordingly, the deep trench structure (and the omission of the metal etch-stop layer) may increase the sensitivity of the capacitive device, may increase the humidity-sensing performance of the capacitive device, and/or may increase the performance of devices and/or integrated circuits in which the capacitive device is included.

Abstract: A semiconductor arrangement includes a first well formed to a first depth and a first width in a substrate and a second well formed to a second depth and a second width in the substrate. The first well is formed in the second well, the first depth is greater than the second depth, and the second width is greater than the first width. A source region is formed in the second well and a drain region is formed in the substrate.

Abstract: The present disclosure provides a method for manufacturing a semiconductor structure. The method includes several operations as follows. A semiconductor substrate is received. A trench along a depth in the semiconductor substrate is formed. The semiconductor substrate is exposed in a hydrogen containing atmosphere. Dopants are inserted into a portion of the semiconductor substrate. A dielectric is filled in the trench. The dopants are driven into a predetermined distance in the semiconductor substrate.

Abstract: The present disclosure provides a method for manufacturing a semiconductor structure. The method includes several operations as follows. A semiconductor substrate is received. A trench along a depth in the semiconductor substrate is formed. The semiconductor substrate is exposed in a hydrogen containing atmosphere. Dopants are inserted into a portion of the semiconductor substrate. A dielectric is filled in the trench. The dopants are driven into a predetermined distance in the semiconductor substrate.

Abstract: A collapsible barbecue grill assembly has a top rack (20), a leg assembly attached under the top rack (20) and a foldable charcoal container (30) mounted on the top rack (20). The leg assembly is combined by means of wedging without using any tools. The top rack (20) is composed of two side frames (22a), (22b) and two panels (24a), (24b) pivotally connecting between the two side frames (22a), (22b). One joint of the panel and the side frames (22) is detachable to allow the top rack to be pivotally folded and the charcoal container (30) is foldable into a flat configuration. Therefore, the volume of the folded barbecue grill assembly is particularly low. Moreover, the barbecue grill assembly uses no trivial accessory and can be conveniently assembled without any tool.

Abstract: A collapsible barbecue grill assembly has a top rack (20), a leg assembly attached under the top rack (20) and a foldable charcoal container (30) mounted on the top rack (20). The leg assembly is combined by means of wedging without using any tools. The top rack (20) is composed of two side frames (22a), (22b) and two panels (24a), (24b) pivotally connecting between the two side frames (22a), (22b). One joint of the panel and the side frames (22) is detachable to allow the top rack to be pivotally folded and the charcoal container (30) is foldable into a flat configuration. Therefore, the volume of the folded barbecue grill assembly is particularly low. Moreover, the barbecue grill assembly uses no trivial accessory and can be conveniently assembled without any tool.

Abstract: An adjustable hiking stick includes a telescopic tube having multiple interconnected sections. Adjacent sections connect at a joint, and the joint includes an end sleeve, a slide limit device, an inside section and an outside section. The outside section has an outside end and an interior surface. The inside section is slidably extended into the outside section and has an inside end and an exterior surface. The end sleeve is attached to the outside end of the outside section and has an annular lip. The slide limit device can be ribs, rings or the like that protruded from the exterior surface of the inside section and is formed adjacent to the inside end of the inside section. The slide limit device will abut the annular lip and keep the inside section from being pulled completely out of the outside section when the inside section is adjusted.

Abstract: A hand tool with a detachable working piece includes a handle having a stud extending out from one end of the handle and a working piece detachably attached to the end of the handle. A locking pin extends through the working piece and the stub of the handle to prevent the working piece from inadvertently detaching from the handle. The locking pin has two steel balls movably mounted in the locking pin and partially extending out from the locking pin to prevent the locking pin from inadvertently detaching from the handle and the working piece. The user can change the working pieces rapidly and easily to deal with changing requirements. Furthermore, the hand tool will save money and storage space because only one handle is needed.