Abstract: A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2?0.8 and r2?r1?0.025.

Abstract: A method of forming graphene on a flexible substrate includes providing a polymer substrate including a metal structure and providing a carbon source and a carrier gas. The method also includes subjecting the polymer substrate to a plasma enhanced chemical vapor deposition (PECVD) process and growing a graphene layer on the copper structure.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Abstract: A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2?0.8 and r2?r1?0.025.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Abstract: A method of forming graphene on a flexible substrate includes providing a polymer substrate including a metal structure and providing a carbon source and a carrier gas. The method also includes subjecting the polymer substrate to a plasma enhanced chemical vapor deposition (PECVD) process and growing a graphene layer on the copper structure.

Abstract: A wideband compound phase-retardation film including a half-wave phase-retardation film and a quarter-wave phase-retardation film with different reactive rod-like liquid crystal combination is provided. The half-wave phase-retardation film uses material having a birefringence of ?n1, and the quarter-wave phase-retardation film uses material having a birefringence of ?n2. The birefringence ?n1 is smaller than the birefringence ?n2. Furthermore, the birefringence dispersion ?n1(?) is also smaller than ?n2(?).

Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Abstract: A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T). One of B and B? is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1˜4, A and A? are identical or different aromatic diamines, and at least one of A and A? is aromatic diamine with ether groups, and A could be the same as or different from A?.

Abstract: A method for fabricating a flexible electrical device is provided. The method includes providing a first substrate, providing a second substrate opposed to the first substrate, wherein one of the first and second substrates includes a polyimide polymer of Formula (I) wherein B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4, directly fabricating a thin film transistor (TFT) on one of the first and second substrates which includes the polyimide polymer of Formula (I), and disposing a medium layer between the first substrate and the second substrate.

Abstract: A polyimide polymer solution, a polyimide polymer, a transparent film, a display device and a solar cell are provided. The polyimide polymer has at least one of a repeating unit of formula (D) and a repeating unit of formula (J) and at least one of a repeating unit of formula (Q) and a repeating unit of formula (T). One of B and B? is cyclo-aliphatic compound, and the other is aromatic compound, a molar mass ratio of the cyclo-aliphatic compound to the aromatic compound is 1˜4, A and A? are identical or different aromatic diamines, and at least one of A and A? is aromatic diamine with ether groups, and A could be the same as or different from A?.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.

Abstract: A polyimide polymer of Formula (I) for flexible electrical device substrate material is provided. In Formula (I), B is a polycyclic aliphatic group, A is an aromatic group containing at least one ether bond, A? is an aromatic or aliphatic group, and 1?n/m?4. The invention also provides a flexible electrical device including the polyimide polymer.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.

Abstract: A polyimide optical compensation film is provided. The polyimide optical compensation film has the formula: wherein when A is cycloaliphatic, B is aromatic or cycloaliphatic, when A is aromatic, B is cycloaliphatic, and n is an integer greater than 1. The optical compensation film has in-plane retardation (R0) and thickness direction retardation (Rth).

Abstract: A polarizing plate is provided. The polarizing plate includes a polarizing film, a first protective film and a second protective film respectively disposed on both sides of the polarizing film, and a polyimide optical compensation film having thickness direction retardation (Rth) or both, in-plane retardation (R0) and thickness direction retardation (Rth) disposed on the first protective film. The invention also provides a liquid crystal display including the polarizing plate.