Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the base, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.

Abstract: A substrate structure is provided, including a substrate, an integrated circuit chip, a circuit structure, and a thermal-dissipating structure. The integrated circuit chip is disposed in the substrate. The circuit structure is electrically connected to the integrated circuit chip. The thermal-dissipating structure is disposed in the substrate and adjacent to the integrated circuit chip, and the thermal-dissipating structure is electrically isolated from the circuit structure.

Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

Abstract: A substrate structure is provided, including a substrate, an integrated circuit chip, a circuit structure, and a thermal-dissipating structure. The integrated circuit chip is disposed in the substrate. The circuit structure is electrically connected to the integrated circuit chip. The thermal-dissipating structure is disposed in the substrate and adjacent to the integrated circuit chip, and the thermal-dissipating structure is electrically isolated from the circuit structure.

Abstract: A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.

Abstract: A wireless charging (WLC) (A4WP) and near field communication (NFC) dual coils PCB structure comprising at least one WLC (A4WP) coil wire having spiral shape and disposed on a printed circuit board (PCB), and a NFC coil wire having spiral shape and disposed on the PCB. At least a portion of the coil wire of the spiral WLC (A4WP) coil is located on a region between two adjacent coil wires of the spiral NFC coil. Therefore, the present invention makes use of spaces of WLC (A4WP) coil such as A4WP or other relevant standards combined with the NFC coil, so that the dual coil of the present invention can reduce the area of the PCB occupied by the electronic device.

Abstract: Microfluidic pumps, methods of fabrication thereof, and methods of use thereof, as well as method of pumping a fluid, are disclosed.

Abstract: Systems for displaying images. The system comprises a display panel comprising a plurality of data lines DL(x), a plurality of gate lines SL(y) perpendicular to the data lines DL(x), and a pixel array coupled to the data lines and the gate lines. The pixel array comprises a first pixel P(x+1, y) coupled to the gate line SL(y+1) and the data line DL(x+1), a second pixel P(x+1, y+1) coupled to the gate line SL(y+1) and the data line DL(x+2), a third pixel P(x, y+1) coupled to the gate line SL(y+2) and the data line DL(x+1), and a fourth pixel P(x, y+2) coupled to the gate line SL(y+2) and the data line DL(x).

Abstract: Microfluidic pumps, methods of fabrication thereof, and methods of use thereof, as well as method of pumping a fluid, are disclosed.

Abstract: An LCD panel having a common electrode and a sliding adjustment disposed thereon. The sliding adjustment is connected to the common electrode and has a guiding groove and a sliding piece therein. The sliding piece can be shifted in the guiding groove to change the common voltage of the common electrode, unifying the illumination of the LCD panel.

Abstract: An LCD panel having a common electrode and a sliding adjustment disposed thereon. The sliding adjustment is connected to the common electrode and has a guiding groove and a sliding piece therein. The sliding piece can be shifted in the guiding groove to change the common voltage of the common electrode, unifying the illumination of the LCD panel.